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Vertical particle alignment of boron nitride and silicon carbide binary filler system for thermal conductivity enhancement

Kim, Kiho; Ju, Hyun; Kim, Jooheon

ArticleIssue Date2016CitationCOMPOSITES SCIENCE AND TECHNOLOGY, v.123, pp 99 - 105PublisherELSEVIER SCI LTD

Improved through-plane thermal conductivity of 3D structured composites via BN alignment and AlN surface modification

Lee, Jooyoung; Kim, Jooheon

ArticleIssue Date2021CitationCOMPOSITES COMMUNICATIONS, v.28PublisherELSEVIER SCI LTD

Diglycidyl ether of bisphenol – A functionalized graphene/copper foam composite with enhanced thermal conductivity and effective electromagnetic interference shielding

Lee, Seonmin; Kim, Jooheon

ArticleIssue Date2022CitationSynthetic Metals, v.284PublisherElsevier Ltd

Improvement of the mechanical properties and thermal conductivity of poly(ether-ether-ketone) with the addition of graphene oxide-carbon nanotube hybrid fillers

Hwang, Yongseon; Kim, Myeongjin; Kim, Jooheon

ArticleIssue Date2013CitationCOMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, v.55, pp 195 - 202PublisherELSEVIER SCI LTD

Flexible and high thermal conductivity thin films based on polymer: Aminated multi-walled carbon nanotubes/micro-aluminum nitride hybrid composites

Choi, Seran; Im, Hyungu; Kim, Jooheon

ArticleIssue Date2012CitationCOMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, v.43, no.11, pp 1860 - 1868PublisherELSEVIER SCI LTD

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