Study on soldering method of multilayer ceramic capacitors for vibration reduction
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Wang, Y. | - |
dc.contributor.author | Ko, B.-H. | - |
dc.contributor.author | Jeong, S. | - |
dc.contributor.author | Park, K.-S. | - |
dc.contributor.author | Park, N.-C. | - |
dc.contributor.author | Park, Y.-P. | - |
dc.date.available | 2020-02-28T18:45:33Z | - |
dc.date.created | 2020-02-12 | - |
dc.date.issued | 2014 | - |
dc.identifier.issn | 0000-0000 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/gachon/handle/2020.sw.gachon/13044 | - |
dc.description.abstract | Owing to the excellent electrical characteristics, multilayer ceramic capacitors (MLCCs) are widely used in a variety of electronic devices nowadays. The accompanying acoustic noise of MLCC related to its vibration is one of the most important factors when selecting MLCCs for specific applications. To evaluate the noise more efficiently, this study investigates a method to build simplified finite element models of MLCC. In addition, vibration analysis has been performed with the simplified model to discuss how structural parameters influence the vibration of MLCC. According to the findings in the study, suggestions and optimized solder design are given to lower the vibration of MLCC. In short, the main aim of this study is to present a new soldering method for MLCC vibration and noise reduction. Copyright © 2014 by ASME. | - |
dc.language | 영어 | - |
dc.language.iso | en | - |
dc.publisher | Web Portal ASME (American Society of Mechanical Engineers) | - |
dc.relation.isPartOf | ASME 2014 Conference on Information Storage and Processing Systems, ISPS 2014 | - |
dc.subject | Acoustic noise | - |
dc.subject | Ceramic capacitors | - |
dc.subject | Ceramic materials | - |
dc.subject | Finite element method | - |
dc.subject | Multilayers | - |
dc.subject | Noise abatement | - |
dc.subject | Soldering | - |
dc.subject | Electrical characteristic | - |
dc.subject | MLCC | - |
dc.subject | Multi-layer ceramic capacitor | - |
dc.subject | Multilayer ceramic capacitors | - |
dc.subject | Optimized soldering method | - |
dc.subject | Structural parameter | - |
dc.subject | Vibration | - |
dc.subject | Vibration and noise reduction | - |
dc.subject | Vibration analysis | - |
dc.title | Study on soldering method of multilayer ceramic capacitors for vibration reduction | - |
dc.type | Article | - |
dc.type.rims | ART | - |
dc.description.journalClass | 1 | - |
dc.identifier.doi | 10.1115/ISPS2014-6965 | - |
dc.identifier.bibliographicCitation | ASME 2014 Conference on Information Storage and Processing Systems, ISPS 2014 | - |
dc.identifier.scopusid | 2-s2.0-84911862599 | - |
dc.citation.title | ASME 2014 Conference on Information Storage and Processing Systems, ISPS 2014 | - |
dc.contributor.affiliatedAuthor | Park, K.-S. | - |
dc.type.docType | Conference Paper | - |
dc.subject.keywordAuthor | Acoustic noise | - |
dc.subject.keywordAuthor | MLCC | - |
dc.subject.keywordAuthor | Optimized soldering method | - |
dc.subject.keywordAuthor | Simplified model | - |
dc.subject.keywordAuthor | Vibration | - |
dc.subject.keywordPlus | Acoustic noise | - |
dc.subject.keywordPlus | Ceramic capacitors | - |
dc.subject.keywordPlus | Ceramic materials | - |
dc.subject.keywordPlus | Finite element method | - |
dc.subject.keywordPlus | Multilayers | - |
dc.subject.keywordPlus | Noise abatement | - |
dc.subject.keywordPlus | Soldering | - |
dc.subject.keywordPlus | Electrical characteristic | - |
dc.subject.keywordPlus | MLCC | - |
dc.subject.keywordPlus | Multi-layer ceramic capacitor | - |
dc.subject.keywordPlus | Multilayer ceramic capacitors | - |
dc.subject.keywordPlus | Optimized soldering method | - |
dc.subject.keywordPlus | Structural parameter | - |
dc.subject.keywordPlus | Vibration | - |
dc.subject.keywordPlus | Vibration and noise reduction | - |
dc.subject.keywordPlus | Vibration analysis | - |
dc.description.journalRegisteredClass | scopus | - |
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