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칩마운터 구조물의 유연성을 고려한 위치와 진동 동시 제어

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dc.contributor.author강민식-
dc.date.available2020-02-29T03:42:30Z-
dc.date.created2020-02-12-
dc.date.issued2013-
dc.identifier.issn1738-2270-
dc.identifier.urihttps://scholarworks.bwise.kr/gachon/handle/2020.sw.gachon/15591-
dc.description.abstractChip mounter which is used to pick chips from the pre-specified position and place them on the target location of PCB is an essential device in semiconductor and LCD industries. Quick and high precision positioning is the key technology needed to increase productivity of chip mounters. As increasing acceleration and deceleration of placing motion, structural vibration induced from inertial reactive force and flexibility of mounter structure becomes a serious problem degrading positioning accuracy. Motivated from these, this paper proposed a new control design algorithm which combines a mounter structure acceleration feedforward compensation and an extended sliding mode control for fine positioning and suppression of structural vibration, simultaneously. The feasibility of the proposed control design was verified along with some simulation results.-
dc.language영어-
dc.language.isoen-
dc.publisher한국반도체디스플레이기술학회-
dc.relation.isPartOf반도체디스플레이기술학회지-
dc.title칩마운터 구조물의 유연성을 고려한 위치와 진동 동시 제어-
dc.title.alternativeSimultaneous Positioning and Vibration Control of Chip Mounter with Structural Flexibility-
dc.typeArticle-
dc.type.rimsART-
dc.description.journalClass2-
dc.identifier.bibliographicCitation반도체디스플레이기술학회지, v.12, no.1, pp.53 - 59-
dc.identifier.kciidART001758755-
dc.citation.endPage59-
dc.citation.startPage53-
dc.citation.title반도체디스플레이기술학회지-
dc.citation.volume12-
dc.citation.number1-
dc.contributor.affiliatedAuthor강민식-
dc.subject.keywordAuthorChip mount device-
dc.subject.keywordAuthorXY- table-
dc.subject.keywordAuthorStructural flexibility-
dc.subject.keywordAuthorAcceleration feedforward compensation-
dc.subject.keywordAuthorSliding mode control-
dc.description.journalRegisteredClasskci-
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Kang, Min Sig
Engineering (기계·스마트·산업공학부(기계공학전공))
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