Optimal iterative learning feedforward control of wafer temperature uniformity in vacuum reflow soldering
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kang, M.S. | - |
dc.contributor.author | Jee, W.H. | - |
dc.date.available | 2020-02-29T09:46:02Z | - |
dc.date.created | 2020-02-11 | - |
dc.date.issued | 2012 | - |
dc.identifier.issn | 0000-0000 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/gachon/handle/2020.sw.gachon/17520 | - |
dc.description.abstract | As device dimensions shrinks to submicrometer range, wafer level vacuum packaging and integration is an emerging method to resolve the requirements from industries. Addressing this issue and in consideration of nearly identical environmental conditions of each soldering process and difficulties in measuring temperature of wafer in real soldering process, in this paper, an optimal run-to-run iterative learning gain scheduled feedforward control of wafer temperature uniformity in vacuum reflow soldering process has been investigated. The proposed technique has been applied to a vacuum reflow soldering equipment for 8-in wafer. Along with run-to-run sequential experiments, gradual improvement of temperature uniformity across a wafer surface has been shown. The wafer was heated to desired temperature recipe and the temperature uniformity was maintained as desired level by applying the proposed control. | - |
dc.language | 영어 | - |
dc.language.iso | en | - |
dc.relation.isPartOf | Proceedings of the IASTED International Conference on Engineering and Applied Science, EAS 2012 | - |
dc.subject | Iterative learning control | - |
dc.subject | Reflow--soldering | - |
dc.subject | Temperature uniformity | - |
dc.subject | Thermal control | - |
dc.subject | Wafer level packaging | - |
dc.subject | Feedforward control | - |
dc.subject | Iterative methods | - |
dc.subject | Optimization | - |
dc.subject | Soldering | - |
dc.subject | Vacuum | - |
dc.subject | Flip chip devices | - |
dc.title | Optimal iterative learning feedforward control of wafer temperature uniformity in vacuum reflow soldering | - |
dc.type | Article | - |
dc.type.rims | ART | - |
dc.description.journalClass | 1 | - |
dc.identifier.doi | 10.2316/P.2012.785-058 | - |
dc.identifier.bibliographicCitation | Proceedings of the IASTED International Conference on Engineering and Applied Science, EAS 2012, pp.122 - 128 | - |
dc.identifier.scopusid | 2-s2.0-84883519096 | - |
dc.citation.endPage | 128 | - |
dc.citation.startPage | 122 | - |
dc.citation.title | Proceedings of the IASTED International Conference on Engineering and Applied Science, EAS 2012 | - |
dc.contributor.affiliatedAuthor | Kang, M.S. | - |
dc.contributor.affiliatedAuthor | Jee, W.H. | - |
dc.type.docType | Conference Paper | - |
dc.subject.keywordAuthor | Gain scheduled feedforward control | - |
dc.subject.keywordAuthor | Optimal iterative learning control | - |
dc.subject.keywordAuthor | Temperature uniformity | - |
dc.subject.keywordAuthor | Thermal control | - |
dc.subject.keywordAuthor | Vacuum reflow soldering | - |
dc.subject.keywordAuthor | Wafer level packaging | - |
dc.subject.keywordPlus | Iterative learning control | - |
dc.subject.keywordPlus | Reflow--soldering | - |
dc.subject.keywordPlus | Temperature uniformity | - |
dc.subject.keywordPlus | Thermal control | - |
dc.subject.keywordPlus | Wafer level packaging | - |
dc.subject.keywordPlus | Feedforward control | - |
dc.subject.keywordPlus | Iterative methods | - |
dc.subject.keywordPlus | Optimization | - |
dc.subject.keywordPlus | Soldering | - |
dc.subject.keywordPlus | Vacuum | - |
dc.subject.keywordPlus | Flip chip devices | - |
dc.description.journalRegisteredClass | scopus | - |
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