Effect of Surface Cleaning on Laser Texturing of Multicrystalline Silicon Wafer
- Authors
- Kim, Hee Soo; Ha, Seung Hyun; Park, Sang Joon; Kim, Ji Hyeon
- Issue Date
- May-2018
- Publisher
- AMER SCIENTIFIC PUBLISHERS
- Keywords
- Laser Texturing; TMAH; CH3COONa; Alkali Cleaning; mc-Crystalline Silicon Solar Cell
- Citation
- SCIENCE OF ADVANCED MATERIALS, v.10, no.5, pp.690 - 693
- Journal Title
- SCIENCE OF ADVANCED MATERIALS
- Volume
- 10
- Number
- 5
- Start Page
- 690
- End Page
- 693
- URI
- https://scholarworks.bwise.kr/gachon/handle/2020.sw.gachon/3823
- DOI
- 10.1166/sam.2018.3148
- ISSN
- 1947-2935
- Abstract
- A HF-free laser texturing process for multicrystalline silicon (mc-silicon) solar cell was developed and the effect of post-laser cleaning on the properties of the solar cell was investigated. Laser texturing of wafers was performed with a Nd-YAG picosecond laser with a wavelength of 1064 nm and anisotropic alkaline etching was performed using a TMAH/CH3COONa solution. The textured wafers showed a decrease in reflectance with increasing cleaning time while the cell efficiencies showed a maximum value of 15.2% after 5 min of cleaning at 70 degrees C. The TMAH/CH3COONa cleaning effectively removed the globules of laser-induced defects from the textured surfaces. In addition, the cleaning (etching) provided pseudo-pyramidal structures on the mc-silicon wafer surfaces. Accordingly, it was found that TMAH/CH3COONa cleaning may play a dual role of cleaning the laser-induced damage and anisotropic surface texturing. However, when the texturing process is accompanied with alkaline TMAH/CH3COONa cleaning, it was necessary to find the optimum etching time. The time should be long enough for removing the laser-induced damages and obtaining rough surfaces. At the same time, the time should not be so long to prevent the formation of high steps at the grain borders.
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Collections - 공과대학 > 화공생명공학과 > 1. Journal Articles
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