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진공증착법을 이용한 센서용 박막재료 및 강유전체에 관한 연구
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 최형욱 | - |
| dc.date.available | 2020-04-25T07:37:39Z | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/gachon/handle/2020.sw.gachon/39151 | - |
| dc.title | 진공증착법을 이용한 센서용 박막재료 및 강유전체에 관한 연구 | - |
| dc.type | Conference | - |
| dc.citation.conferenceName | 경기도 | - |
| dc.citation.conferencePlace | South Korea | - |
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Collections - IT융합대학 > 전기공학과 > 2. Conference Papers
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Related Researcher
- Choi, Hyung Wook
- College of IT Convergence (Department of Electrical Engineering)