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Flexible and Transparent Cu Electronics by Low-Temperature Acid-Assisted Laser Processing of Cu Nanoparticles

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dc.contributor.authorKwon, Jinhyeong-
dc.contributor.authorCho, Hyunmin-
dc.contributor.authorSuh, Young Duk-
dc.contributor.authorLee, Jinhwan-
dc.contributor.authorLee, Habeom-
dc.contributor.authorJung, Jinwook-
dc.contributor.authorKim, Dongkwan-
dc.contributor.authorLee, Daeho-
dc.contributor.authorHong, Sukjoon-
dc.contributor.authorKo, Seung Hwan-
dc.date.available2020-02-27T19:44:01Z-
dc.date.created2020-02-07-
dc.date.issued2017-02-
dc.identifier.issn2365-709X-
dc.identifier.urihttps://scholarworks.bwise.kr/gachon/handle/2020.sw.gachon/6435-
dc.description.abstractCopper is a promising electronic material due to low cost and high electrical conductivity. However, the oxidation problem in an ambient condition creates a crucial issue in practical applications. In this paper, a simple and cost-effective Cu patterning method has been developed on flexible PET film by combining a solution processable Cu nanoparticle patterning and a low-temperature postprocessing with acetic acid treatment, laser sintering process, and acid-assisted laser sintering process. The acid-assisted laser sintering processed Cu electrode shows superior characteristics in electrical, mechanical, and chemical stability over other postprocessing methods. Finally, the Cu electrode is applied to flexible electronics applications such as flexible and transparent heaters and touch screen panels.-
dc.language영어-
dc.language.isoen-
dc.publisherWILEY-
dc.relation.isPartOfADVANCED MATERIALS TECHNOLOGIES-
dc.subjectCOPPER NANOPARTICLES-
dc.subjectFABRICATION-
dc.subjectOXIDATION-
dc.subjectOPTOELECTRONICS-
dc.subjectCONDUCTORS-
dc.subjectREDUCTION-
dc.subjectNETWORK-
dc.subjectOXIDE-
dc.subjectFILM-
dc.subjectXPS-
dc.titleFlexible and Transparent Cu Electronics by Low-Temperature Acid-Assisted Laser Processing of Cu Nanoparticles-
dc.typeArticle-
dc.type.rimsART-
dc.description.journalClass1-
dc.identifier.wosid000398999400006-
dc.identifier.doi10.1002/admt.201600222-
dc.identifier.bibliographicCitationADVANCED MATERIALS TECHNOLOGIES, v.2, no.2-
dc.identifier.scopusid2-s2.0-85028970570-
dc.citation.titleADVANCED MATERIALS TECHNOLOGIES-
dc.citation.volume2-
dc.citation.number2-
dc.contributor.affiliatedAuthorLee, Daeho-
dc.type.docTypeArticle-
dc.subject.keywordAuthoracid treatment-
dc.subject.keywordAuthorbending test-
dc.subject.keywordAuthorcopper nanoparticles-
dc.subject.keywordAuthorflexible substrates-
dc.subject.keywordAuthorlow-temperature processes, selective laser sintering-
dc.subject.keywordAuthorsurface analysis-
dc.subject.keywordAuthortouch panel-
dc.subject.keywordPlusCOPPER NANOPARTICLES-
dc.subject.keywordPlusFABRICATION-
dc.subject.keywordPlusOXIDATION-
dc.subject.keywordPlusOPTOELECTRONICS-
dc.subject.keywordPlusCONDUCTORS-
dc.subject.keywordPlusREDUCTION-
dc.subject.keywordPlusNETWORK-
dc.subject.keywordPlusOXIDE-
dc.subject.keywordPlusFILM-
dc.subject.keywordPlusXPS-
dc.relation.journalResearchAreaMaterials Science-
dc.relation.journalWebOfScienceCategoryMaterials Science, Multidisciplinary-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
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