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A Process-Variation-Tolerant On-Chip CMOS Thermometer for Auto Temperature Compensated Self-Refresh of Low-Power Mobile DRAM

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dc.contributor.authorShim, Daeyong-
dc.contributor.authorJeong, Hyunsik-
dc.contributor.authorLee, Hyunjoong-
dc.contributor.authorRhee, Cyuyeol-
dc.contributor.authorJeong, Deog-Kyoon-
dc.contributor.authorKim, Suhwan-
dc.date.accessioned2023-07-24T07:40:34Z-
dc.date.available2023-07-24T07:40:34Z-
dc.date.created2023-07-24-
dc.date.issued2013-10-
dc.identifier.issn0018-9200-
dc.identifier.urihttps://scholarworks.bwise.kr/gachon/handle/2020.sw.gachon/88626-
dc.description.abstractSmaller transistors mean that capacitors are charged less uniformly, which increases the self-refresh current in the DRAMs used in mobile devices. Adaptive self-refresh using an on-chip thermometer can solve this problem. We propose an on-chip CMOS thermometer specifically designed for controlling the refresh period of a DRAM. This thermometer includes a novel temperature sensor which has been implemented and integrated into an LPDDR2 chip. The LPDDR2 chip is fabricated in a 44-nm DRAM process. The sensor has a temperature sensitivity of -3.2 mV/degrees C, over a range of 0 degrees C to 110 degrees C. Its resolution is 1.94 degrees C and is only limited by the 6.2-mV step of the associated resistor ladder not by its own design. The linearity of the sensor permits one-point calibration, after which the errors in 61 sample circuits ranged between -1.42 degrees C and +2.66 degrees C. The sensor has an active area of 0.001725 mm and consumes less than 0.36 mu W on average with a supply of 1.1 V. At its lowest operating temperature, this thermometer reduces the IDD6 current of the LPDDR2 chip by almost half.-
dc.language영어-
dc.language.isoen-
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC-
dc.relation.isPartOfIEEE JOURNAL OF SOLID-STATE CIRCUITS-
dc.titleA Process-Variation-Tolerant On-Chip CMOS Thermometer for Auto Temperature Compensated Self-Refresh of Low-Power Mobile DRAM-
dc.typeArticle-
dc.type.rimsART-
dc.description.journalClass1-
dc.identifier.wosid000324929700025-
dc.identifier.doi10.1109/JSSC.2013.2272338-
dc.identifier.bibliographicCitationIEEE JOURNAL OF SOLID-STATE CIRCUITS, v.48, no.10, pp.2550 - 2557-
dc.description.isOpenAccessN-
dc.identifier.scopusid2-s2.0-84884701537-
dc.citation.endPage2557-
dc.citation.startPage2550-
dc.citation.titleIEEE JOURNAL OF SOLID-STATE CIRCUITS-
dc.citation.volume48-
dc.citation.number10-
dc.contributor.affiliatedAuthorRhee, Cyuyeol-
dc.type.docTypeArticle; Proceedings Paper-
dc.subject.keywordAuthorLow-power-
dc.subject.keywordAuthormobile DRAM-
dc.subject.keywordAuthorself-refresh-
dc.subject.keywordAuthortemperature sensor-
dc.subject.keywordAuthorthermometer-
dc.subject.keywordPlusSENSOR-
dc.subject.keywordPlusSDRAM-
dc.relation.journalResearchAreaEngineering-
dc.relation.journalWebOfScienceCategoryEngineering, Electrical & Electronic-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
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반도체대학 (반도체·전자공학부)
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