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Complete filling of 41 nm trench pattern using Cu seed layer deposited by SAM-modified electroless plating and electron-beam evaporation Go to Link

Han, W. K.; Hwang, G. H.; Hong, S. J.; An, H. H.; Yoon, C. S.; Kim, J. H.; Lee, M. J.; Hong, G.; Park, K. S.; Kang, S. G.

ArticleIssue Date2010CitationApplied Surface Science, v.256, no.8, pp 2649 - 2653PublisherElsevier BV

SCISCIESCOPUS

New optical transition, structural, and ferromagnetic properties of InCrP:Zn implanted with Cr

Shon, Yoon; Lee, J. W.; Lee, D. J.; Yoon, I. T.; Kwon, Y. H.; Kim, H. S.; Kang, T. W.; Kyhm, J. H.; Song, J. D.; Koo, H. C., et al.

ArticleIssue Date2014CitationJournal of Luminescence, v.154, pp 593 - 596PublisherElsevier BV

SCISCIESCOPUS

Superconformal filling of 41 nm trenches with Cu electroless deposition on Au-activated self-assembled monolayer Go to Link

Han, W. K.; Hwang, G. H.; Hong, S. J.; An, H. H.; Yoon, C. S.; Kim, J. H.; Lee, M. J.; Hong, G.; Park, K. S.; Kang, S. G.

ArticleIssue Date2010CitationMaterials Chemistry and Physics, v.123, no.2-3, pp 401 - 406PublisherElsevier BV

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Browsing by An, H. H.Author

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