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Effects of Hydrolysis Reaction and Abrasive Drag Force Accelerator on Enhancing Si-Wafer Polishing Rate and Improving Si-Wafer Surface RoughnessGo to Linkopen access

Jeon, Min-Uk; Kim, Pil-Su; Han, Man-Hyup; Lee, Se-Hui; Lee, Hye-Min; Kim, Su-Bin; Park, Jin-Hyung; Cho, Kyoo-Chul; Park, Jinsub; Park, Jea-Gun

ArticleIssue Date2025CitationNanomaterials, v.15, no.16, pp 1 - 23PublisherMDPI
SCIESCOPUS
The Chemical Deformation of a Thermally Cured Polyimide Film Surface into Neutral 1,2,4,5-Benzentetracarbonyliron and 4,4′-Oxydianiline to Remarkably Enhance the Chemical–Mechanical Planarization Polishing RateGo to Linkopen access

Han, Man-Hyup; Koh, Hyun-Sung; Heo, Il-Haeng; Kim, Myung-Hoe; Kim, Pil-Su; Jeon, Min-Uk; Kim, Min-Ji; Jin, Woo-Hyun; Cho, Kyoo-Chul; Park, Jinsub, et al.

ArticleIssue Date2025CitationNanomaterials, v.15, no.6, pp 1 - 15PublisherMDPI
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