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A study of the curing behavior of polyamic acid coated on a Cu or Zn layerGo to Link

Dong, Wen-Guo; Kim, Gun-Hong; Choi, Jae-Youn; Ybon, Jun-Ro; Kim, Young-Ho

ArticleIssue Date2008CitationColloids and Surfaces A: Physicochemical and Engineering Aspects, v.324, no.1-3, pp 122 - 125PublisherElsevier BV
SCISCIESCOPUS
The Effect of Fillers in Nonconductive Adhesive on the Reliability of Chip-on-Glass Bonding with Sn/Cu BumpsGo to Link

Kim, Byeung Gee; Kim, Sun-Chul; Dong, Wen-Guo; Kim, Young-Ho

ArticleIssue Date2011CitationMaterials Transactions, v.52, no.11, pp 2106 - 2110PublisherJapan Institute of Metals
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