ScholarWorks@Hanyang University

Browsing by Harr, Kyoung-MooAuthor

All A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
전체 가 나 다 라 마 바 사 아 자 차 카 타 파 하

Showing results 1 to 4 of 4

SCOPUS
A new COF bonding technique using Sn bumps and a non-conductive adhesive (NCA) for image sensor packagingGo to Link

Harr, Kyoung-Moo; Kim, Young-Min; Lim, Dae Hwan; Kim, Young Ho; Kim, Jin-Gu; Yi, Sung

ArticleIssue Date2009CitationProceedings - Electronic Components and Technology Conference, pp 1475 - 1478
SCISCIESCOPUS
Development of chip-on-flex bonding using Sn-based bumps and non-conductive adhesiveGo to Link

Harr, Kyoung-Moo; Kim, Sun-Chul; Kim, Young-Min; Kim, Young-Ho

ArticleIssue Date2015CitationMicroelectronics and Reliability, v.55, no.8, pp 1241 - 1247PublisherElsevier Ltd.
SCISCIESCOPUS
Highly reliable, fine pitch chip on glass (COG) joints fabricated using Sn/Cu bumps and non-conductive adhesivesGo to Link

Kim, Byeung-Gee; Lee, Sang-Mok; Jo, Yun-Song; Kim, Sun-Chul; Harr, Kyoung-Moo; Kim, Young-Ho

ArticleIssue Date2011CitationMicroelectronics and Reliability, v.51, no.4, pp 851 - 859PublisherElsevier Ltd.
SCIESCOPUSKCICANDI
Mechanism of the Delayed Growth of Intermetallic Compound at the Interface between Sn-4.0Ag-0.5Cu and Cu-Zn SubstrateGo to Link

Kim, Young Min; Harr, Kyoung-Moo; Kim, Young-Ho

ArticleIssue Date2010CitationElectronic Materials Letters, v.6, no.4, pp 151 - 154Publisher대한금속·재료학회
1
CONTACT US

RSS_1.0 RSS_2.0 ATOM_1.0

222, Wangsimni-ro, Seongdong-gu, Seoul, 04763, Korea+82-2-2220-1366

COPYRIGHT © 2024 HANYANG UNIVERSITY.

Certain data included herein are derived from the © Web of Science of Clarivate Analytics. All rights reserved.
You may not copy or re-distribute this material in whole or in part without the prior written consent of Clarivate Analytics.

BROWSE

한국어