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Complete filling of 41 nm trench pattern using Cu seed layer deposited by SAM-modified electroless plating and electron-beam evaporationGo to Link

Han, W. K.; Hwang, G. H.; Hong, S. J.; An, H. H.; Yoon, C. S.; Kim, J. H.; Lee, M. J.; Hong, G.; Park, K. S.; Kang, S. G.

ArticleIssue Date2010CitationApplied Surface Science, v.256, no.8, pp 2649 - 2653PublisherElsevier BV
SCISCIESCOPUS
Superconformal filling of 41 nm trenches with Cu electroless deposition on Au-activated self-assembled monolayerGo to Link

Han, W. K.; Hwang, G. H.; Hong, S. J.; An, H. H.; Yoon, C. S.; Kim, J. H.; Lee, M. J.; Hong, G.; Park, K. S.; Kang, S. G.

ArticleIssue Date2010CitationMaterials Chemistry and Physics, v.123, no.2-3, pp 401 - 406PublisherElsevier BV
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