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Intermetallic compound formation in the interface between SAC305 solder and Cu-xZn-yNi substratesGo to Link

Hwang, Ji Hwan; Kim, Ji Hwan; Kim, Tae Jin; Kim, Young-Ho; Lee, Won Jong

ArticleIssue Date2013CitationICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, pp 426 - 429PublisherIEEE
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Wetting characteristics of Cu-xZn layers for Sn-3.0Ag-0.5Cu soldersGo to Link

Lee, Ji Hyun; Kim, Young Min; Hwang, Ji Hwan; Kim, Young-Ho

ArticleIssue Date2013CitationJournal of Alloys and Compounds, v.567, pp 10 - 14PublisherElsevier BV
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