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Effect of solder pads on the fatigue life of FBGA memory modules under harmonic excitation by using a global-local modeling technique Go to Link

Cinar, Yusuf; Jang, Jinwoo; Jang, Gunhee; Kim, Seonsik; Jang, Jaeseok

ArticleIssue Date2013CitationMicroelectronics and Reliability, v.53, no.12, pp 2043 - 2051PublisherElsevier Ltd.

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Failure mechanism of FBGA solder joints in memory module subjected to harmonic excitation Go to Link

Cinar, Yusuf; Jang, Jinwoo; Jang, Gunhee; Kim, Seonsik; Jang, Jaeseok; Chang, Jinkyu; Jun, Yonghyun

ArticleIssue Date2012CitationMicroelectronics and Reliability, v.52, no.4, pp 735 - 743PublisherElsevier Ltd.

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Fatigue life estimations of solid-state drives with dummy solder balls under vibration Go to Link

Jang, Jinwoo; Jang, Gunhee; Lee, Juyub; Cho, Yeungjung; Cinar, Yusuf

ArticleIssue Date2016CitationInternational Journal of Fatigue, v.88, pp 42 - 48PublisherElsevier BV

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Forced Vibration Analysis of an IPM Motor for Electrical Vehicles due to Magnetic Force Go to Link

Yim, K. H.; Jang, Jinwoo; Jang, Gunhee; Kim, M. G.; Kim, Kinam

ArticleIssue Date2012CitationIEEE Transactions on Magnetics, v.48, no.11, pp 2981 - 2984PublisherInstitute of Electrical and Electronics Engineers

SCOPUS

Sensitivity analysis on solder joint fatigue life of solid state drives by finite element method and Monte Carlo simulation

Cho, Yeung; Jang, Jinwoo; Jang, Gunhee

ArticleIssue Date2017CitationASME 2017 Conference on Information Storage and Processing Systems, ISPS 2017, pp 1 - 8PublisherAmerican Society of Mechanical Engineers

SCIESCOPUS

Sensitivity analysis on the fatigue life of solid state drive solder joints by the finite element method and Monte Carlo simulation Go to Link

Cho, Yeungjung; Jang, Jinwoo; Jang, Gunhee

ArticleIssue Date2018CitationMicrosystem Technologies, v.24, no.11, pp.4669 - 4676PublisherSpringer Verlag

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Browsing by Jang, JinwooAuthor

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