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Adhesion of NCF to oxidized Si wafers after oxygen plasma treatmentGo to Link

Jang, Min-Seok; Ma, Sung Woo; Song, Jongsoo; Sung, Myungmo; Kim, Young-Ho

ArticleIssue Date2017CitationMicroelectronics and Reliability, v.78, pp 220 - 226PublisherElsevier Ltd.
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The formation of Cu2O nanoparticles in polyimide using Cu electrodes via chemical curing, and their application in flexible polymer memory devicesGo to Link

Choi, Dong Joo; Kim, Jeong-Ki; Seong, Haseob; Jang, Min-Seok; Kim, Young-Ho

ArticleIssue Date2015CitationOrganic Electronics, v.27, pp 65 - 71PublisherElsevier BV
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