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Highly reliable, fine pitch chip on glass (COG) joints fabricated using Sn/Cu bumps and non-conductive adhesivesGo to Link

Kim, Byeung-Gee; Lee, Sang-Mok; Jo, Yun-Song; Kim, Sun-Chul; Harr, Kyoung-Moo; Kim, Young-Ho

ArticleIssue Date2011CitationMicroelectronics and Reliability, v.51, no.4, pp 851 - 859PublisherElsevier Ltd.
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