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전체 가 나 다 라 마 바 사 아 자 차 카 타 파 하

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Complete filling of 41 nm trench pattern using Cu seed layer deposited by SAM-modified electroless plating and electron-beam evaporationGo to Link

Han, W. K.; Hwang, G. H.; Hong, S. J.; An, H. H.; Yoon, C. S.; Kim, J. H.; Lee, M. J.; Hong, G.; Park, K. S.; Kang, S. G.

ArticleIssue Date2010CitationApplied Surface Science, v.256, no.8, pp 2649 - 2653PublisherElsevier BV
SCISCIESCOPUS
Expression of RUNX3 in skin cancersGo to Link

Lee, J. H.; Pyon, J. -K.; Kim, D. W.; Lee, S. H.; Nam, H. S.; Kang, S. G.; Kim, C. H.; Lee, Y. J.; Chun, J. S.; Cho, M. K.

ArticleIssue Date2011CitationClinical and Experimental Dermatology, v.36, no.7, pp 769 - 774PublisherBlackwell Publishing Inc.
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