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전체 가 나 다 라 마 바 사 아 자 차 카 타 파 하

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SCOPUS
Advanced hybrid interpolation based on edge direction extracted from the DCT coefficient distributionGo to Link

Kim, Jaehun; Kim, Kibaek; Yun, Janghyeok; Jeong, Jechang; Jeon, Gwanggil

ArticleIssue Date2012Citation8th International Conference on Signal Image Technology and Internet Based Systems, SITIS 2012r, pp.918 - 924PublisherIEEE
SCOPUS
AiRS: A Large-Scale Recommender System at NAVER NewsGo to Link

Lim, Hongjun; Lee, Yeon-Chang; Lee, Jin-Seo; Han, Sanggyu; Kim, Seunghyeon; Jeong, Yeongjong; Kim, Changbong; Kim, Jaehun; Han, Sunghoon; Choi, Solbi, et al.

ArticleIssue Date2022Citation2022 IEEE 38TH INTERNATIONAL CONFERENCE ON DATA ENGINEERING (ICDE 2022), pp 3386 - 3398PublisherIEEE COMPUTER SOC
SCIESCOPUS
An artificial neural tactile sensing systemGo to Link

Chun, Sungwoo; Kim, Jong Seok; Yoo, Yongsang; Choi, Youngin; Jung, Sung Jun; Jang, Dong Pyo; Lee, Gwangyeob; Song, Kang-Il; Nam, Kum Seok; Youn, Inchan, et al.

ArticleIssue Date2021CitationNATURE ELECTRONICS, v.4, no.6, pp 429 - 438PublisherNATURE RESEARCH
SCIESCOPUS
Characteristics of social perception assessed in schizophrenia using virtual realityGo to Link

Kim, Kwanguk; Kim, Jae-Jin; Kim, Jaehun; Park, Da-Eun; Jang, Hee Jeong; Ku, Jeonghun; Kim, Chan-Hyung; Kim, In Young; Kim, Sun I.

ArticleIssue Date2007CitationCyberpsychology and Behavior, v.10, no.2, pp 215 - 219PublisherMary Ann Liebert Inc.
SCIESCOPUS
Control over seed framework enables oriented 3D nanocrystalline perovskite films for light-emitting diodesGo to Link

Jeong, Jinju; Park, Sang Wook; Kim, Jaehun; Lee, Dong Gyu; Ahn, Hyungju; Lee, Tae Kyung; Lee, Seungjin

ArticleIssue Date2026CitationNano Energy, v.154, pp 1 - 10PublisherElsevier Ltd
SCOPUS
Sound Event Detection Based on Beamformed Convolutional Neural Network Using Multi-MicrophonesGo to Link

Kim, Jaehun; Noh, Kyoungin; Kim, Jaeha; Chang, Joon Hyuk

ArticleIssue Date2018CitationProceedings of 2018 6th IEEE International Conference on Network Infrastructure and Digital Content, IC-NIDC 2018, pp.170 - 173PublisherInstitute of Electrical and Electronics Engineers Inc.
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