Sun, Hyuk; Jin, Zhe-Jun; Kim, Myoung-Gyun; Park, Chan-Seo; Yun, Tae-Yeoul
ArticleIssue Date2011CitationIEEE Transactions on Components, Packaging and Manufacturing Technology, v.1, no.5, pp 731 - 741PublisherInstitute of Electrical and Electronics Engineers Inc.