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Effect of solder pads on the fatigue life of FBGA memory modules under harmonic excitation by using a global-local modeling techniqueGo to Link

Cinar, Yusuf; Jang, Jinwoo; Jang, Gunhee; Kim, Seonsik; Jang, Jaeseok

ArticleIssue Date2013CitationMicroelectronics and Reliability, v.53, no.12, pp 2043 - 2051PublisherElsevier Ltd.
SCISCIESCOPUS
Failure mechanism of FBGA solder joints in memory module subjected to harmonic excitationGo to Link

Cinar, Yusuf; Jang, Jinwoo; Jang, Gunhee; Kim, Seonsik; Jang, Jaeseok; Chang, Jinkyu; Jun, Yonghyun

ArticleIssue Date2012CitationMicroelectronics and Reliability, v.52, no.4, pp 735 - 743PublisherElsevier Ltd.
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