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Enhanced thermal performance of phase change material-integrated fin-type heat sinks for high power electronics coolingGo to Link

Kim, Su Ho; Heu, Chang Sung; Mok, Jin Yong; Kang, Seok-Won; Kim, Dong Rip

ArticleIssue Date2022CitationInternational Journal of Heat and Mass Transfer, v.184, pp 1 - 11PublisherPergamon Press Ltd.
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