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Chip to Chip Bonding Using Cu Bumps Capped with Thin Sn Layers and the Effect of Microstructure on the Shear Strength of JointsGo to Link

Kim, Yang Ho; Ma, Sung Woo; Kim, Young-Ho

ArticleIssue Date2014CitationJournal of Electronic Materials, v.43, no.9, pp 3296 - 3306PublisherInstitute of Electrical and Electronics Engineers
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