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전체 가 나 다 라 마 바 사 아 자 차 카 타 파 하

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SCIESCOPUS
Epoxy/silane pre-synthesis improving thermal properties and adhesion strength of silica-filled non-conductive adhesive for fine-pitch thermocompression bondingGo to Link

Lee, Tae-Young; Kim, Min-Su; Ko, Yong-Ho; Kim, Young-Ho; Yoo, Sehoon

ArticleIssue Date2020CitationJOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.31, no.2, pp.1227 - 1235PublisherSPRINGER
SCIESCOPUS
Growth of intermetallic compounds and brittle fracture behavior of Sn-Ag-Cu/ENIG joint with columnar Ni-P layerGo to Link

Seo, Wonil; Kim, Min-Su; Ko, Yong-Ho; Kim, Young-Ho; Yoo, Sehoon

ArticleIssue Date2021CitationJOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.32, no.1, pp.1042 - 1051PublisherSPRINGER
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