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Dishing-free chemical mechanical planarization for copper filmsGo to Link

Yun, Sang-Su; Son, Young-Hye; Jeong, Gi-ppeum; Lee, Je-hwan; Jeong, Jong-han; Bae, Jae-Young; Kim, Sung-In; Park, Jin-Hyung; Park, Jea Gun

ArticleIssue Date2021CitationColloids and Surfaces A: Physicochemical and Engineering Aspects, v.616, pp.1 - 15PublisherElsevier B.V.
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