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Effects of Hydrolysis Reaction and Abrasive Drag Force Accelerator on Enhancing Si-Wafer Polishing Rate and Improving Si-Wafer Surface RoughnessGo to Linkopen access

Jeon, Min-Uk; Kim, Pil-Su; Han, Man-Hyup; Lee, Se-Hui; Lee, Hye-Min; Kim, Su-Bin; Park, Jin-Hyung; Cho, Kyoo-Chul; Park, Jinsub; Park, Jea-Gun

ArticleIssue Date2025CitationNanomaterials, v.15, no.16, pp 1 - 23PublisherMDPI
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