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Improvement of die shift by solder self-alignment for fan-out package process applications

Park, H.-P.; Kim, S.; Park, J.-Y.; Kim, Y.-H.

ConferenceIssue Date2018Citation20th IEEE Electronics Packaging Technology Conference, EPTC 2018, pp.825 - 830PublisherInstitute of Electrical and Electronics Engineers Inc.PlaceSI; Resort World Sentosa

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Browsing by Park, J.-Y.Author

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