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Effect of Cu electroplating parameters on microvoid formation and high-speed shear strength in Sn-3.0Ag-0.5Cu/Cu joints Go to Link

Park, Jae-Yong; Seo, Wonil; Yoo, Sehoon; Kim, Young-Ho

ArticleIssue Date2017CitationJournal of Alloys and Compounds, v.724, pp 492 - 500PublisherElsevier BV

SCISCIESCOPUS

Effect of Ni-P Plating Temperature on Growth of Interfacial Intermetallic Compound in Electroless Nickel Immersion Gold/Sn-Ag-Cu Solder Joints Go to Link

Seo, Wonil; Kim, Kyoung-Ho; Kim, Young-Ho; Yoo, Sehoon

ArticleIssue Date2018CitationJournal of Electronic Materials, v.47, no.1, pp 110 - 116PublisherInstitute of Electrical and Electronics Engineers

SCIESCOPUS

Electromigration reliability of Sn-3.0Ag-0.5Cu/Cu-Zn solder joints Go to Link

Park, Jae-Yong; Lee, Taeyoung; Seo, Wonil; Yoo, Sehoon; Kim, Young-Ho

ArticleIssue Date2019CitationJOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.30, no.8, pp.7645 - 7653PublisherSPRINGER

SCIESCOPUS

Growth of intermetallic compounds and brittle fracture behavior of Sn-Ag-Cu/ENIG joint with columnar Ni-P layer Go to Link

Seo, Wonil; Kim, Min-Su; Ko, Yong-Ho; Kim, Young-Ho; Yoo, Sehoon

ArticleIssue Date2021CitationJOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.32, no.1, pp.1042 - 1051PublisherSPRINGER

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Browsing by Seo, WonilAuthor

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