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Liquid metal particles enabled ultrahigh isotropic thermal conductivity in soft thermal interface materials for biochips packagingGo to Link

Lee, Yoonsu; Oh, Sangkeun; Song, Yu-Jin; Jang, Ji-un; Lee, Joo Hyung; Won, Seoyeon; Yoo, Joohwan; Eom, Youngho; Shin, Han-Kyun; Zhang, Huanan, et al.

ArticleIssue Date2026CitationCHEMICAL ENGINEERING JOURNAL, v.541, pp 1 - 12PublisherELSEVIER SCIENCE SA
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