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Utilized solder spalling for de-bonding process in Fan-Out Wafer Level Package
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 김영호 | - |
| dc.date.accessioned | 2021-08-02T09:57:21Z | - |
| dc.date.available | 2021-08-02T09:57:21Z | - |
| dc.date.created | 2021-06-30 | - |
| dc.date.issued | 2019-11-23 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/11268 | - |
| dc.publisher | Institute for Materials Research, TOHOKU UNIVERSITY | - |
| dc.title | Utilized solder spalling for de-bonding process in Fan-Out Wafer Level Package | - |
| dc.type | Conference | - |
| dc.contributor.affiliatedAuthor | 김영호 | - |
| dc.identifier.bibliographicCitation | 11th Korea-Japan Berkeley Symposium on Advanced Materials | - |
| dc.relation.isPartOf | 11th Korea-Japan Berkeley Symposium on Advanced Materials | - |
| dc.citation.title | 11th Korea-Japan Berkeley Symposium on Advanced Materials | - |
| dc.citation.conferencePlace | The Hokkaido University Tokyo Office | - |
| dc.type.rims | CONF | - |
| dc.description.journalClass | 1 | - |
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Collections - 서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers
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