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Electromagnetic interference shielding effect of double layer copper patterns with moisture ventilation at package level
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 김영호 | - |
| dc.date.accessioned | 2021-08-02T09:57:54Z | - |
| dc.date.available | 2021-08-02T09:57:54Z | - |
| dc.date.created | 2021-06-30 | - |
| dc.date.issued | 2019-11-15 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/11406 | - |
| dc.publisher | The Korean Microelectronics and Packaging Society | - |
| dc.title | Electromagnetic interference shielding effect of double layer copper patterns with moisture ventilation at package level | - |
| dc.type | Conference | - |
| dc.contributor.affiliatedAuthor | 김영호 | - |
| dc.identifier.bibliographicCitation | The 18th International symposium on Microelectronics and Packaging jointed with the 21st International Conference on Electronic Materials and Packaging | - |
| dc.relation.isPartOf | The 18th International symposium on Microelectronics and Packaging jointed with the 21st International Conference on Electronic Materials and Packaging | - |
| dc.citation.title | The 18th International symposium on Microelectronics and Packaging jointed with the 21st International Conference on Electronic Materials and Packaging | - |
| dc.citation.conferencePlace | Hotel Aqua Palace, Busan, Korea | - |
| dc.type.rims | CONF | - |
| dc.description.journalClass | 1 | - |
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Collections - 서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers
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