Joint properties and reliability of Cu/Sn-Ag pillar bumps via low-temperature thermo-compression bonding
DC Field | Value | Language |
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dc.contributor.author | Park, Jae-Yong | - |
dc.contributor.author | Lee, Ja Yeon | - |
dc.contributor.author | Park, Hwan-Pil | - |
dc.contributor.author | Kim, Sung-Chul | - |
dc.contributor.author | Lee, Tae-Young | - |
dc.contributor.author | Yoo, Sehoon | - |
dc.contributor.author | Kim, Young-Ho | - |
dc.date.accessioned | 2021-08-02T11:27:19Z | - |
dc.date.available | 2021-08-02T11:27:19Z | - |
dc.date.created | 2021-05-11 | - |
dc.date.issued | 2019-08 | - |
dc.identifier.issn | 0167-9317 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/13304 | - |
dc.description.abstract | The joint properties and reliability of Cu/SnAg pillar joints via a low-temperature thermo-compression bonding (LT-TCB) process below the melting temperature of SnAg solder were investigated in this study. The bonding temperature was 150 °C. The pitches of the Cu/SnAg pillar bumps were 40 and 60 μm. The LT-TCB process was conducted using a non-conductive adhesive (NCA) and the post-curing of the NCA was conducted at 150 °C for 30 s. The SnAg solder was not melted but deformed to contact with the Cu pad following the LT-TCB. As the bonding time of the LT-TCB increased from 3 to 5 s, the gap between the SnAg and the Cu pad decreased and some areas showed an interfacial intermetallic compound (IMC) indicating that bonding had occurred. The electrical resistance of the LT-TCB samples increased after a temperature and humidity (TH) test and a thermal cycle (TC) test. The gap between the SnAg and the Cu pad decreased and interfacial IMCs formed in some regions following the reliability tests. The electrical resistance of the 3-s bonding sample was higher than that of the 5-s sample following the reliability tests. The bonding pressure also affected the joint properties. The electrical resistance after the TH and TC tests decreased with increasing bonding pressure. Without post-curing of the NCA, a crack occurred after the reliability test. The NCA did not fully cure during the LT-TCB; thus, the NCA did not play a role as a stress reliever. | - |
dc.language | 영어 | - |
dc.language.iso | en | - |
dc.publisher | ELSEVIER | - |
dc.title | Joint properties and reliability of Cu/Sn-Ag pillar bumps via low-temperature thermo-compression bonding | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Kim, Young-Ho | - |
dc.identifier.doi | 10.1016/j.mee.2019.04.030 | - |
dc.identifier.scopusid | 2-s2.0-85067194177 | - |
dc.identifier.wosid | 000487764900008 | - |
dc.identifier.bibliographicCitation | MICROELECTRONIC ENGINEERING, v.216, pp.1 - 7 | - |
dc.relation.isPartOf | MICROELECTRONIC ENGINEERING | - |
dc.citation.title | MICROELECTRONIC ENGINEERING | - |
dc.citation.volume | 216 | - |
dc.citation.startPage | 1 | - |
dc.citation.endPage | 7 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.description.journalClass | 1 | - |
dc.description.isOpenAccess | N | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Engineering | - |
dc.relation.journalResearchArea | Science & Technology - Other Topics | - |
dc.relation.journalResearchArea | Optics | - |
dc.relation.journalResearchArea | Physics | - |
dc.relation.journalWebOfScienceCategory | Engineering, Electrical & Electronic | - |
dc.relation.journalWebOfScienceCategory | Nanoscience & Nanotechnology | - |
dc.relation.journalWebOfScienceCategory | Optics | - |
dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
dc.subject.keywordPlus | CHIP | - |
dc.subject.keywordPlus | KINETICS | - |
dc.subject.keywordAuthor | Low-temperature thermo-compression bonding | - |
dc.subject.keywordAuthor | Nonconductive adhesive | - |
dc.subject.keywordAuthor | Reliability | - |
dc.subject.keywordAuthor | Cu pillar bump | - |
dc.subject.keywordAuthor | Thermal cycle test | - |
dc.subject.keywordAuthor | Temperature and humidity | - |
dc.identifier.url | https://www.sciencedirect.com/science/article/pii/S0167931718303010?via%3Dihub | - |
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