Enhanced thermal conductivity of graphene nanoplatelet filled polymer composite based on thermal percolation behavior
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Jang, Ji-Un | - |
dc.contributor.author | So, Soon Oh | - |
dc.contributor.author | Kim, Jong Hyeok | - |
dc.contributor.author | Kim, Seong Yun | - |
dc.contributor.author | KIM, Seong Hun | - |
dc.date.accessioned | 2022-07-06T06:26:49Z | - |
dc.date.available | 2022-07-06T06:26:49Z | - |
dc.date.created | 2022-04-06 | - |
dc.date.issued | 2022-04 | - |
dc.identifier.issn | 2452-2139 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/139003 | - |
dc.description.abstract | The demand for lightweight heat-dissipating composites has increased interest in strategies to improve the thermal conductivity of polymer composites by incorporating nanocarbon fillers. In this study, composite incorporating uniformly dispersed high content (∼50 wt%) of graphene nanoplatelet was fabricated with low-viscosity polyamide 6 (PA6) resin. The measured thermal conductivity of the composite exhibited thermal percolation when GNP content exceeded 30 wt%, and the in-plane thermal conductivity improved to 19.39 W/m·K (1315% increase compared to neat PA6) at the filler content of 50 wt%. In addition, thermal conductivity of the prepared composites was in good agreement with theoretical results based on Nan's model (filler content of 0–30 wt%) considering interfacial thermal resistance and the percolation equation (filler content of 40–50 wt%) considering a connected filler network. It was confirmed that thermal percolation was generated due to contacts and network formation between fillers in the fabricated composites using an internal structure analysis. Potential insights on the design, manufacture, and application of nanocomposites exhibiting heat dissipation performance can be provided by composite systems using low-viscosity resin and theoretical evaluation methods. | - |
dc.language | 영어 | - |
dc.language.iso | en | - |
dc.publisher | ELSEVIER SCI LTD | - |
dc.title | Enhanced thermal conductivity of graphene nanoplatelet filled polymer composite based on thermal percolation behavior | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | KIM, Seong Hun | - |
dc.identifier.doi | 10.1016/j.coco.2022.101110 | - |
dc.identifier.scopusid | 2-s2.0-85126102521 | - |
dc.identifier.wosid | 000776703000002 | - |
dc.identifier.bibliographicCitation | COMPOSITES COMMUNICATIONS, v.31, pp.1 - 5 | - |
dc.relation.isPartOf | COMPOSITES COMMUNICATIONS | - |
dc.citation.title | COMPOSITES COMMUNICATIONS | - |
dc.citation.volume | 31 | - |
dc.citation.startPage | 1 | - |
dc.citation.endPage | 5 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.description.journalClass | 1 | - |
dc.description.isOpenAccess | N | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Composites | - |
dc.subject.keywordPlus | CARBON NANOTUBE | - |
dc.subject.keywordPlus | MANAGEMENT | - |
dc.subject.keywordAuthor | Composite | - |
dc.subject.keywordAuthor | Polyamide 6 | - |
dc.subject.keywordAuthor | Graphene nanoplatelet | - |
dc.subject.keywordAuthor | Thermal conductivity | - |
dc.identifier.url | https://www.sciencedirect.com/science/article/pii/S2452213922000523?via%3Dihub | - |
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.
222, Wangsimni-ro, Seongdong-gu, Seoul, 04763, Korea+82-2-2220-1365
COPYRIGHT © 2021 HANYANG UNIVERSITY.
Certain data included herein are derived from the © Web of Science of Clarivate Analytics. All rights reserved.
You may not copy or re-distribute this material in whole or in part without the prior written consent of Clarivate Analytics.