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The effect of current supply duration during stepwise electrical sintering of silver nanoparticles

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dc.contributor.authorLee, Iksang-
dc.contributor.authorHussain, Arif-
dc.contributor.authorLee, Hee-Lak-
dc.contributor.authorMoon, Yoon-Jae-
dc.contributor.authorHwang, Jun-Young-
dc.contributor.authorMoon, Seung-Jae-
dc.date.accessioned2022-07-06T11:37:31Z-
dc.date.available2022-07-06T11:37:31Z-
dc.date.created2021-12-08-
dc.date.issued2021-11-
dc.identifier.issn2075-4701-
dc.identifier.urihttps://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/140450-
dc.description.abstractWe studied the effect of current supply duration at final‐step currents during the stepwise electrical sintering of silver (Ag) nanoparticles (NPs). Ag NPs ink was inkjet‐printed onto Eagle‐XG glass substrates. Constant final‐step currents of 0.4 and 0.5 A with various time intervals were ap-plied to the printed samples. The final‐step current of 0.5 A damaged the line at a comparatively shorter time duration. On the other hand, the lower final‐step current of 0.4 A prevented the line damage at longer time durations while producing comparatively lower Ag NPs specific resistance. The minimum specific resistances of the printed samples sintered at 0.4 and 0.5 A were 3.59 μΩ∙cm and 3.79 μΩ∙cm, respectively. Furthermore, numerical temperature estimation and scanning electron microscope (SEM) analysis were conducted to elaborate on the results. The numerical temperature estimation results implied that the lower estimated peak temperature at the final‐step current of 0.4 A helped prevent Ag NP line damage. The SEM micrographs suggested that a high surface porosity—caused by higher sintering peak temperatures—in the case of the 0.5 A final‐step current resulted in a comparatively higher Ag NP line‐specific resistance. This contribution is a step forward in the development of Ag NP sintering for printed electronics applications.-
dc.language영어-
dc.language.isoen-
dc.publisherMDPI-
dc.titleThe effect of current supply duration during stepwise electrical sintering of silver nanoparticles-
dc.typeArticle-
dc.contributor.affiliatedAuthorMoon, Seung-Jae-
dc.identifier.doi10.3390/met11111878-
dc.identifier.scopusid2-s2.0-85119456496-
dc.identifier.wosid000725326500001-
dc.identifier.bibliographicCitationMETALS, v.11, no.11, pp.1 - 12-
dc.relation.isPartOfMETALS-
dc.citation.titleMETALS-
dc.citation.volume11-
dc.citation.number11-
dc.citation.startPage1-
dc.citation.endPage12-
dc.type.rimsART-
dc.type.docTypeArticle-
dc.description.journalClass1-
dc.description.isOpenAccessY-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaMaterials Science-
dc.relation.journalResearchAreaMetallurgy & Metallurgical Engineering-
dc.relation.journalWebOfScienceCategoryMaterials Science, Multidisciplinary-
dc.relation.journalWebOfScienceCategoryMetallurgy & Metallurgical Engineering-
dc.subject.keywordPlusINK-
dc.subject.keywordPlusFILMS-
dc.subject.keywordAuthorstepwise current sintering-
dc.subject.keywordAuthorsilver nanoparticle-
dc.subject.keywordAuthorspecific resistance-
dc.subject.keywordAuthorneck growth-
dc.subject.keywordAuthorelectrical sintering-
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COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)
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