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Dynamic band alignment modulation of ultrathin WOx/ZnO stack for high on/off ratio field-effect switching applications

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dc.contributor.authorLee, Ho-In-
dc.contributor.authorPark, Jinseon-
dc.contributor.authorKim, Yun Ji-
dc.contributor.authorHeo, Sunwoo-
dc.contributor.authorHwang, Jeongwoon-
dc.contributor.authorKim, Seung-Mo-
dc.contributor.authorLee, Yongsu-
dc.contributor.authorCho, Kyeongjae-
dc.contributor.authorSung, Myung Mo-
dc.contributor.authorLee, Byoung Hun-
dc.date.accessioned2022-07-07T17:33:45Z-
dc.date.available2022-07-07T17:33:45Z-
dc.date.created2021-05-12-
dc.date.issued2020-08-
dc.identifier.issn2040-3364-
dc.identifier.urihttps://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/145331-
dc.description.abstractA two-dimensional (2D) WOx/ZnO stack reveals a unique carrier transport behavior, which can be utilized as a novel device element to achieve a very high on/off ratio (>10(6)) and an off current density lower than 1 nA cm(-2). These unique behaviors are explained by a dynamic band alignment between WOx and ZnO, which can be actively modulated by a gate bias. The performance of FET utilizing the WOx/ZnO stack is comparable to those of other 2D heterojunction devices; however, it has a unique benefit in terms of process integration because of very low temperature process capability (T < 110 degrees C). The high on/off switching with extremely low off current density utilizing the dynamic band alignment modulation at the WOx/ZnO stack can be a very useful element for future device applications, especially in monolithic 3D integration or flexible electronics.-
dc.language영어-
dc.language.isoen-
dc.publisherROYAL SOC CHEMISTRY-
dc.titleDynamic band alignment modulation of ultrathin WOx/ZnO stack for high on/off ratio field-effect switching applications-
dc.typeArticle-
dc.contributor.affiliatedAuthorSung, Myung Mo-
dc.identifier.doi10.1039/c9nr10988a-
dc.identifier.scopusid2-s2.0-85089787300-
dc.identifier.wosid000561429100047-
dc.identifier.bibliographicCitationNANOSCALE, v.12, no.32, pp.16755 - 16761-
dc.relation.isPartOfNANOSCALE-
dc.citation.titleNANOSCALE-
dc.citation.volume12-
dc.citation.number32-
dc.citation.startPage16755-
dc.citation.endPage16761-
dc.type.rimsART-
dc.type.docTypeArticle-
dc.description.journalClass1-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaChemistry-
dc.relation.journalResearchAreaScience & Technology - Other Topics-
dc.relation.journalResearchAreaMaterials Science-
dc.relation.journalResearchAreaPhysics-
dc.relation.journalWebOfScienceCategoryChemistry, Multidisciplinary-
dc.relation.journalWebOfScienceCategoryNanoscience & Nanotechnology-
dc.relation.journalWebOfScienceCategoryMaterials Science, Multidisciplinary-
dc.relation.journalWebOfScienceCategoryPhysics, Applied-
dc.subject.keywordPlusGRAPHENE-
dc.subject.keywordPlusTRANSISTORS-
dc.subject.keywordPlusTRANSPORT-
dc.subject.keywordPlusDIODES-
dc.subject.keywordPlusMOS2-
dc.subject.keywordPlusHETEROSTRUCTURES-
dc.subject.keywordPlusPERFORMANCE-
dc.subject.keywordPlusDEFECTS-
dc.identifier.urlhttps://pubs.rsc.org/en/content/articlelanding/2020/NR/C9NR10988A-
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