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High Hole Mobility and Low Leakage Thin-Body (In)GaSb p-MOSFETs Grown on High-Bandgap AlGaSb

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dc.contributor.authorKim, Sang-Hyeon-
dc.contributor.authorRoh, Ilpyo-
dc.contributor.authorHan, Jae-Hoon-
dc.contributor.authorGeum, Dae-Myeong-
dc.contributor.authorKim, Seong Kwang-
dc.contributor.authorKang, Soo Seok-
dc.contributor.authorKang, Hang-Kyu-
dc.contributor.authorLee, Woo Chul-
dc.contributor.authorKim, Seong Keun-
dc.contributor.authorHwang, Do Kyung-
dc.contributor.authorSong, Yun Heub-
dc.contributor.authorSong, Jin Dong-
dc.date.accessioned2021-07-30T04:50:03Z-
dc.date.available2021-07-30T04:50:03Z-
dc.date.created2021-05-11-
dc.date.issued2021-11-
dc.identifier.urihttps://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/1457-
dc.description.abstractIn this study, we demonstrated low leakage current and high mobility thin body (In)GaSb p-FETs. Through the optimization of the V/III ratio during the epitaxial growth, we achieved a highly insulating bottom Al0.95Ga0.05Sb barrier, which eliminates the junction leakage. We also suppressed the interface trap-assisted surface leakage current by introducing In0.53Ga0.47As surface passivation on the GaSb channel. Furthermore, GaSb/InGaSb/GaSb quantum well (QW) channel structure provided significant improvement in effective mobility ( {mu }-{mathrm{ eff}} ) characteristics. As a result, the fabricated devices showed the lowest off-leakage current ( {I} -{mathrm{ off}} ), subthreshold slope ( {S}. {S}.) and high mu -{mathrm{ eff}} among reported GaSb p-MOSFETs.-
dc.language영어-
dc.language.isoen-
dc.publisherInstitute of Electrical and Electronics Engineers Inc.-
dc.titleHigh Hole Mobility and Low Leakage Thin-Body (In)GaSb p-MOSFETs Grown on High-Bandgap AlGaSb-
dc.typeArticle-
dc.contributor.affiliatedAuthorSong, Yun Heub-
dc.identifier.doi10.1109/JEDS.2020.3039370-
dc.identifier.scopusid2-s2.0-85096879628-
dc.identifier.wosid000622098400009-
dc.identifier.bibliographicCitationIEEE Journal of the Electron Devices Society, v.9, pp.42 - 48-
dc.relation.isPartOfIEEE Journal of the Electron Devices Society-
dc.citation.titleIEEE Journal of the Electron Devices Society-
dc.citation.volume9-
dc.citation.startPage42-
dc.citation.endPage48-
dc.type.rimsART-
dc.type.docTypeArticle-
dc.description.journalClass1-
dc.description.isOpenAccessY-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaEngineering-
dc.relation.journalWebOfScienceCategoryEngineering, Electrical & Electronic-
dc.subject.keywordPlusAluminum alloys-
dc.subject.keywordPlusArsenic compounds-
dc.subject.keywordPlusGallium compounds-
dc.subject.keywordPlusHole mobility-
dc.subject.keywordPlusIII-V semiconductors-
dc.subject.keywordPlusLeakage currents-
dc.subject.keywordPlusPassivation-
dc.subject.keywordPlusSemiconducting antimony compounds-
dc.subject.keywordPlusSemiconductor alloys-
dc.subject.keywordPlusSemiconductor quantum wells-
dc.subject.keywordPlusChannel structures-
dc.subject.keywordPlusEffective mobilities-
dc.subject.keywordPlusFabricated device-
dc.subject.keywordPlusLow-leakage current-
dc.subject.keywordPlusOff-leakage current-
dc.subject.keywordPlusSubthreshold slope-
dc.subject.keywordPlusSurface leakage currents-
dc.subject.keywordPlusSurface passivation-
dc.subject.keywordPlusMOSFET devices-
dc.subject.keywordAuthorGaSb-
dc.subject.keywordAuthorIII-V-
dc.subject.keywordAuthorInGaAs passivation-
dc.subject.keywordAuthorultra-thin-body (UTB)-
dc.identifier.urlhttps://ieeexplore.ieee.org/document/9264257-
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