Interpolymer complexes of poly(acrylic acid) and poly(ethylene glycol) for low dishing in STI CMP
DC Field | Value | Language |
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dc.contributor.author | Seo, Jihoon | - |
dc.contributor.author | Moon, Jinok | - |
dc.contributor.author | Moon, Sunho | - |
dc.contributor.author | Paik, Ungyu | - |
dc.date.accessioned | 2022-07-15T20:55:41Z | - |
dc.date.available | 2022-07-15T20:55:41Z | - |
dc.date.created | 2021-05-12 | - |
dc.date.issued | 2015-10 | - |
dc.identifier.issn | 0169-4332 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/156296 | - |
dc.description.abstract | Although poly(acrylic acid) (PAA) has been used as a passivation agent for high polish rate selectivity between SiO2 and Si3N4 in STI CMP, it causes severe dishing during the over-polishing step. Here, we fabricated interpolymer complexes of PAA and poly(ethylene glycol) (PEG) as passivation agent for low dishing as well as high selectivity. PAA and PEG form a cross-linked network structure through H-bonding, which is called an "interpolymer complex". During the over-polishing step, the cross-linked network structure of the PAA-PEG interpolymer complex prevents abrasives from polishing SiO2 in the trenches, resulting in a significant decrease in dishing. These results provide researchers with a new approach toward passivation agents to provide low dishing in STI CMP. | - |
dc.language | 영어 | - |
dc.language.iso | en | - |
dc.publisher | ELSEVIER SCIENCE BV | - |
dc.title | Interpolymer complexes of poly(acrylic acid) and poly(ethylene glycol) for low dishing in STI CMP | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Paik, Ungyu | - |
dc.identifier.doi | 10.1016/j.apsusc.2015.06.078 | - |
dc.identifier.scopusid | 2-s2.0-84941952201 | - |
dc.identifier.wosid | 000361220700064 | - |
dc.identifier.bibliographicCitation | APPLIED SURFACE SCIENCE, v.353, pp.499 - 503 | - |
dc.relation.isPartOf | APPLIED SURFACE SCIENCE | - |
dc.citation.title | APPLIED SURFACE SCIENCE | - |
dc.citation.volume | 353 | - |
dc.citation.startPage | 499 | - |
dc.citation.endPage | 503 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.description.journalClass | 1 | - |
dc.description.isOpenAccess | N | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Chemistry | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalResearchArea | Physics | - |
dc.relation.journalWebOfScienceCategory | Chemistry, Physical | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Coatings & Films | - |
dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
dc.relation.journalWebOfScienceCategory | Physics, Condensed Matter | - |
dc.subject.keywordPlus | CHEMICAL-MECHANICAL PLANARIZATION | - |
dc.subject.keywordPlus | MOLECULAR-WEIGHT | - |
dc.subject.keywordPlus | SILICON-NITRIDE | - |
dc.subject.keywordPlus | ADSORPTION | - |
dc.subject.keywordPlus | CERIA | - |
dc.subject.keywordPlus | PARTICLES | - |
dc.subject.keywordPlus | BEHAVIOR | - |
dc.subject.keywordPlus | REMOVAL | - |
dc.subject.keywordPlus | DIOXIDE | - |
dc.subject.keywordPlus | OXIDE) | - |
dc.subject.keywordAuthor | Passivation agent | - |
dc.subject.keywordAuthor | PAA | - |
dc.subject.keywordAuthor | PEG | - |
dc.subject.keywordAuthor | Interpolymer complexes | - |
dc.subject.keywordAuthor | Dishing | - |
dc.subject.keywordAuthor | CMP | - |
dc.identifier.url | https://www.sciencedirect.com/science/article/pii/S0169433215014221?via%3Dihub | - |
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