Self-Transport of Condensed Liquid in Micro Cooling Device Using Distributed Meniscus Pumping
DC Field | Value | Language |
---|---|---|
dc.contributor.author | So, Hong yun | - |
dc.contributor.author | Pisano, Albert P. | - |
dc.date.accessioned | 2022-07-15T22:12:58Z | - |
dc.date.available | 2022-07-15T22:12:58Z | - |
dc.date.created | 2021-05-13 | - |
dc.date.issued | 2015-06 | - |
dc.identifier.issn | 0743-7463 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/156949 | - |
dc.description.abstract | This paper reports a reliable passive micro pump system combining the physical properties of a tapered microchannel and sharp microstructures. This tailored micro, channel with triple-spike microstructures was created to transport condensed liquid into the reservoir chamber in a micro cooling device and in the case of chip off-mode prepare the next cooling cycle before chip on-mode, allowing the reliable and continuous circulation of coolant without liquid being trapped in the vapor channel causing dryout limitation. At the tapered channel end, the pinned liquid meniscus was distributed by a middle spike and then continued to,overflow into the condenser chamber due to extended capillary action. | - |
dc.language | 영어 | - |
dc.language.iso | en | - |
dc.publisher | AMER CHEMICAL SOC | - |
dc.title | Self-Transport of Condensed Liquid in Micro Cooling Device Using Distributed Meniscus Pumping | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | So, Hong yun | - |
dc.identifier.doi | 10.1021/acs.langmuir.5b00313 | - |
dc.identifier.scopusid | 2-s2.0-84934922487 | - |
dc.identifier.wosid | 000356755300037 | - |
dc.identifier.bibliographicCitation | LANGMUIR, v.31, no.23, pp.6588 - 6594 | - |
dc.relation.isPartOf | LANGMUIR | - |
dc.citation.title | LANGMUIR | - |
dc.citation.volume | 31 | - |
dc.citation.number | 23 | - |
dc.citation.startPage | 6588 | - |
dc.citation.endPage | 6594 | - |
dc.type.rims | ART | - |
dc.type.docType | 정기학술지(Article(Perspective Article포함)) | - |
dc.description.journalClass | 1 | - |
dc.description.isOpenAccess | N | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Chemistry | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalWebOfScienceCategory | Chemistry, Multidisciplinary | - |
dc.relation.journalWebOfScienceCategory | Chemistry, Physical | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.subject.keywordPlus | HEAT PIPES | - |
dc.subject.keywordPlus | ELECTRONICS | - |
dc.subject.keywordPlus | CHIP | - |
dc.subject.keywordPlus | SURFACES | - |
dc.identifier.url | https://pubs.acs.org/doi/10.1021/acs.langmuir.5b00313 | - |
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.
222, Wangsimni-ro, Seongdong-gu, Seoul, 04763, Korea+82-2-2220-1365
COPYRIGHT © 2021 HANYANG UNIVERSITY.
Certain data included herein are derived from the © Web of Science of Clarivate Analytics. All rights reserved.
You may not copy or re-distribute this material in whole or in part without the prior written consent of Clarivate Analytics.