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MTJ 버퍼층의 Ta/Ru 층의 두께 및 공정 온도 조건에 따른 Roughness에 대한 연구
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 오영택 | - |
| dc.contributor.author | 최철민 | - |
| dc.contributor.author | 송윤흡 | - |
| dc.contributor.author | H. Sukegawa | - |
| dc.contributor.author | S. Mitan | - |
| dc.date.accessioned | 2022-07-16T04:10:14Z | - |
| dc.date.available | 2022-07-16T04:10:14Z | - |
| dc.date.created | 2021-05-13 | - |
| dc.date.issued | 2014-06 | - |
| dc.identifier.issn | 1016135X | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/159680 | - |
| dc.description.abstract | The roughness of MTJ has an effect on TMR and RA. We measured Ra, P-V, and RMS by using AFM, with varying the thickness of Ta and Ru in the Buffer Layer and process temperature condition so as to find a little better roughness condition. Furthermore, we present a direction for finding even better roughness condition. | - |
| dc.language | 한국어 | - |
| dc.language.iso | ko | - |
| dc.publisher | 대한전자공학회 | - |
| dc.title | MTJ 버퍼층의 Ta/Ru 층의 두께 및 공정 온도 조건에 따른 Roughness에 대한 연구 | - |
| dc.type | Article | - |
| dc.contributor.affiliatedAuthor | 송윤흡 | - |
| dc.identifier.bibliographicCitation | 전자공학회논문지, v.37, no.1, pp.336 - 338 | - |
| dc.relation.isPartOf | 전자공학회논문지 | - |
| dc.citation.title | 전자공학회논문지 | - |
| dc.citation.volume | 37 | - |
| dc.citation.number | 1 | - |
| dc.citation.startPage | 336 | - |
| dc.citation.endPage | 338 | - |
| dc.type.rims | ART | - |
| dc.type.docType | Proceeding | - |
| dc.description.journalClass | 2 | - |
| dc.description.isOpenAccess | N | - |
| dc.description.journalRegisteredClass | other | - |
| dc.identifier.url | http://www.dbpia.co.kr/journal/articleDetail?nodeId=NODE02438531 | - |
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Collections - 서울 공과대학 > 서울 융합전자공학부 > 1. Journal Articles
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Related Researcher
- Song, Yun Heub
- COLLEGE OF ENGINEERING (SCHOOL OF ELECTRONIC ENGINEERING)