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The Effect of Mechanical Stress on Cell Characteristics in MONOS Structures

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dc.contributor.authorOh, Young-Taek-
dc.contributor.authorRoh, Ii-Pyo-
dc.contributor.authorKino, Hisashi-
dc.contributor.authorTanaka, Tetsu-
dc.contributor.authorSong, Yun Heub-
dc.date.accessioned2021-08-02T12:53:53Z-
dc.date.available2021-08-02T12:53:53Z-
dc.date.issued2018-10-
dc.identifier.issn0018-9383-
dc.identifier.issn1557-9646-
dc.identifier.urihttps://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/16028-
dc.description.abstractWe investigated the impact of mechanical stress on the cell characteristics of metal-oxide-nitride-oxide-semiconductor (MONOS) structures through experimental observations based on a curvature method for residual stress extraction and an analysis of the interface state. Residual stress induced on a substrate was observed to change from compressive to tensile depending on the tungsten process conditions; a high interface trap density was extracted under a high compressive stress environment based on a silicon bonding model. These interface trap densities were suggested as being attributable to a critical factor weakening the leakage characteristics of the MONOS structure. Besides, interface traps interrupted electron tunneling due to unintended charge trapping at the interface, which deteriorated memory characteristics indicated by a reduction in trap density. These results experimentally supported the effects of mechanical stress on device characteristics and reliability, which could be a straightforward way toward understanding the impact of stress for improved future flash memory applications.-
dc.format.extent7-
dc.language영어-
dc.language.isoENG-
dc.publisherInstitute of Electrical and Electronics Engineers-
dc.titleThe Effect of Mechanical Stress on Cell Characteristics in MONOS Structures-
dc.typeArticle-
dc.publisher.location미국-
dc.identifier.doi10.1109/TED.2018.2865007-
dc.identifier.scopusid2-s2.0-85052674411-
dc.identifier.wosid000445239700037-
dc.identifier.bibliographicCitationIEEE Transactions on Electron Devices, v.65, no.10, pp 4313 - 4319-
dc.citation.titleIEEE Transactions on Electron Devices-
dc.citation.volume65-
dc.citation.number10-
dc.citation.startPage4313-
dc.citation.endPage4319-
dc.type.docTypeArticle-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClasssci-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaEngineering-
dc.relation.journalResearchAreaPhysics-
dc.relation.journalWebOfScienceCategoryEngineering-
dc.relation.journalWebOfScienceCategoryElectrical & Electronic-
dc.relation.journalWebOfScienceCategoryPhysics, Applied-
dc.subject.keywordPlusSONOS NONVOLATILE MEMORY-
dc.subject.keywordPlusRESIDUAL-STRESS-
dc.subject.keywordPlusTHIN-FILMS-
dc.subject.keywordAuthorCurvature method-
dc.subject.keywordAuthorinterface trap densities-
dc.subject.keywordAuthormechanical stress-
dc.subject.keywordAuthormetal-oxide-nitride-oxide-semiconductor (MONOS) structure-
dc.subject.keywordAuthorresidual stress-
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8447253-
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