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Synthesis and characterization of single- and few-layer mica nanosheets by the microwave-assisted solvothermal approach

Authors
Tran Van KhaiNa, Han GilKwak, Dong SubKwon, Yong JungHam, HeonShim, Kwang BoKim, Hyoun Woo
Issue Date
Apr-2013
Publisher
IOP PUBLISHING LTD
Citation
NANOTECHNOLOGY, v.24, no.14, pp.1 - 10
Indexed
SCIE
SCOPUS
Journal Title
NANOTECHNOLOGY
Volume
24
Number
14
Start Page
1
End Page
10
URI
https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/163117
DOI
10.1088/0957-4484/24/14/145602
ISSN
0957-4484
Abstract
We have successfully fabricated single-and few-layer mica nanosheets, by means of using a solvothermal method in conjunction with a microwave irradiated expansion process. In the solvothermal process, dissolved potassium ions were intercalated onto the interlayer space of the mica. Following this, microwave irradiation facilitates the exfoliation of individual nanosheets. The synthesized products were characterized by field emission scanning electron microscopy, transmission electron microscopy (TEM), atomic force microscopy (AFM), x-ray diffraction, x-ray photoelectron spectroscopy (XPS), and Raman spectroscopy measurements. AFM and TEM studies claimed the existence of single-layer mica. High-resolution TEM (HR-TEM) investigations revealed that the exfoliated product corresponded to a crystalline mica structure, being comprised of Si, Al, O, and K elements. XPS spectra exhibited the major constituent peaks, including O 1s, Si 2p, Al 2p, and K 2p. In addition, C atomic concentration has been slightly increased by the contamination during exfoliation, presumably due to the increase of the exposed mica surface. The C 1s XPS spectra revealed that the C-C bonding in organic surface contaminants was broken, whereas the Si-C bonding was enhanced, by the exfoliation process. The O 1s XPS spectra revealed that the Si-O bonding in mica was broken, generating the O-Si-C bonding. This study paves the way towards the fabrication of single-or few-layer inorganic nanosheets of desired materials, via a convenient and efficient route.
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