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Solderable and electroplatable flexible electronic circuit on a porous stretchable elastomer

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dc.contributor.authorJeong, Gi Seok-
dc.contributor.authorBaek, Dong-Hyun-
dc.contributor.authorJung, Ha Chul-
dc.contributor.authorSong, Ji Hoon-
dc.contributor.authorMoon, Jin Hee-
dc.contributor.authorHong, Suck Won-
dc.contributor.authorKim, In Young-
dc.contributor.authorLee, Sang-Hoon-
dc.date.accessioned2022-07-16T14:36:19Z-
dc.date.available2022-07-16T14:36:19Z-
dc.date.created2021-05-12-
dc.date.issued2012-07-
dc.identifier.issn2041-1723-
dc.identifier.urihttps://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/165143-
dc.description.abstractA variety of flexible and stretchable electronics have been reported for use in flexible electronic devices or biomedical applications. The practical and wider application of such flexible electronics has been limited because commercial electronic components are difficult to be directly integrated into flexible stretchable electronics and electroplating is still challenging. Here, we propose a novel method for fabricating flexible and stretchable electronic devices using a porous elastomeric substrate. Pressurized steam was applied to an uncured polydimethylsiloxane layer for the simple and cost-effective production of porous structure. An electroplated nickel anchor had a key role in bonding commercial electronic components on elastomers by soldering techniques, and metals could be stably patterned and electroplated for practical uses. The proposed technology was applied to develop a plaster electrocardiogram dry electrode and multi-channel microelectrodes that could be used as a long-term wearable biosignal monitor and for brain signal monitoring, respectively.-
dc.language영어-
dc.language.isoen-
dc.publisherNATURE PUBLISHING GROUP-
dc.titleSolderable and electroplatable flexible electronic circuit on a porous stretchable elastomer-
dc.typeArticle-
dc.contributor.affiliatedAuthorKim, In Young-
dc.identifier.doi10.1038/ncomms1980-
dc.identifier.scopusid2-s2.0-84864839707-
dc.identifier.wosid000306995000049-
dc.identifier.bibliographicCitationNATURE COMMUNICATIONS, v.3, pp.1 - 8-
dc.relation.isPartOfNATURE COMMUNICATIONS-
dc.citation.titleNATURE COMMUNICATIONS-
dc.citation.volume3-
dc.citation.startPage1-
dc.citation.endPage8-
dc.type.rimsART-
dc.type.docTypeArticle-
dc.description.journalClass1-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaScience & Technology - Other Topics-
dc.relation.journalWebOfScienceCategoryMultidisciplinary Sciences-
dc.subject.keywordPlusHIGH-CONDUCTIVITY-
dc.subject.keywordPlusNERVOUS-SYSTEM-
dc.subject.keywordPlusINTERFACES-
dc.identifier.urlhttps://www.nature.com/articles/ncomms1980-
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