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Equivalent-Circuit Modeling for Multilayer Capacitors Based on Coupled Transmission-Line Theory
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Sun, Hyuk | - |
| dc.contributor.author | Jin, Zhe-Jun | - |
| dc.contributor.author | Kim, Myoung-Gyun | - |
| dc.contributor.author | Park, Chan-Seo | - |
| dc.contributor.author | Yun, Tae-Yeoul | - |
| dc.date.accessioned | 2022-07-16T20:49:37Z | - |
| dc.date.available | 2022-07-16T20:49:37Z | - |
| dc.date.issued | 2011-05 | - |
| dc.identifier.issn | 2156-3950 | - |
| dc.identifier.issn | 2156-3985 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/168560 | - |
| dc.description.abstract | This paper provides a novel modeling methodology for multilayer capacitors (MLCs) based on the coupled transmission-line theory. From an analytical solution of a single-layer capacitor, first- and second-order equivalent-circuit models for an N-layer capacitor are introduced using an infinite series approximation. The models demonstrated accurate prediction of the behavior of MLCs up to the first and second self-resonant frequencies. In addition, distributed physical parameters for the models were extracted directly from S-parameter measurements without an optimization process. High-frequency MLCs were measured up to 20 GHz using a vector network analyzer and compared with models from 1 to 47 pF. | - |
| dc.format.extent | 11 | - |
| dc.language | 영어 | - |
| dc.language.iso | ENG | - |
| dc.publisher | Institute of Electrical and Electronics Engineers Inc. | - |
| dc.title | Equivalent-Circuit Modeling for Multilayer Capacitors Based on Coupled Transmission-Line Theory | - |
| dc.type | Article | - |
| dc.publisher.location | 미국 | - |
| dc.identifier.doi | 10.1109/TCPMT.2011.2115241 | - |
| dc.identifier.scopusid | 2-s2.0-84859797338 | - |
| dc.identifier.wosid | 000292827900012 | - |
| dc.identifier.bibliographicCitation | IEEE Transactions on Components, Packaging and Manufacturing Technology, v.1, no.5, pp 731 - 741 | - |
| dc.citation.title | IEEE Transactions on Components, Packaging and Manufacturing Technology | - |
| dc.citation.volume | 1 | - |
| dc.citation.number | 5 | - |
| dc.citation.startPage | 731 | - |
| dc.citation.endPage | 741 | - |
| dc.type.docType | Article | - |
| dc.description.isOpenAccess | N | - |
| dc.description.journalRegisteredClass | sci | - |
| dc.description.journalRegisteredClass | scie | - |
| dc.description.journalRegisteredClass | scopus | - |
| dc.relation.journalResearchArea | Engineering | - |
| dc.relation.journalResearchArea | Materials Science | - |
| dc.relation.journalWebOfScienceCategory | Engineering, Manufacturing | - |
| dc.relation.journalWebOfScienceCategory | Engineering, Electrical & Electronic | - |
| dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
| dc.subject.keywordPlus | Equivalent circuits | - |
| dc.subject.keywordPlus | Models | - |
| dc.subject.keywordPlus | Multilayers | - |
| dc.subject.keywordPlus | Natural frequencies | - |
| dc.subject.keywordPlus | Scattering parameters | - |
| dc.subject.keywordAuthor | Coupled transmission line | - |
| dc.subject.keywordAuthor | equivalent circuit | - |
| dc.subject.keywordAuthor | multilayer capacitor | - |
| dc.subject.keywordAuthor | multilayer chip capacitor | - |
| dc.identifier.url | https://ieeexplore.ieee.org/document/5756648 | - |
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