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A 80x60 Micro-Bolometer CMOS Thermal Imager Integrated with a Low-Noise 12-Bit DAC
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kim, Ki-Duk | - |
| dc.contributor.author | Park, Seunghyun | - |
| dc.contributor.author | Lee, Byunghun | - |
| dc.contributor.author | Lee, Hyung-Min | - |
| dc.contributor.author | Cho, Gyu-Hyeong | - |
| dc.date.accessioned | 2022-07-19T04:49:00Z | - |
| dc.date.available | 2022-07-19T04:49:00Z | - |
| dc.date.issued | 2022-08 | - |
| dc.identifier.issn | 0278-0046 | - |
| dc.identifier.issn | 1557-9948 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/170030 | - |
| dc.description.abstract | A low-cost 80x60 micro-bolometer CMOS thermal imager is presented. The imager system integrated with a proposed 12-bit biasing digital-to-analog converter (DAC) has 100 ms start-up time, which is 300x faster than commercial products, while ensuring comparable 100 mK noise-equivalent temperature difference (NETD). The low-noise biasing DAC adopts a current-mode divider- stacking structure and a bit-inversion technique, leading to mismatch-insensitive operation. The 12-bit biasing DAC in a 0.18 m CMOS imager IC has a low noise of 1.89 Vrms and INL/DNL of 0.14/0.09 LSB, respectively. | - |
| dc.format.extent | 5 | - |
| dc.language | 영어 | - |
| dc.language.iso | ENG | - |
| dc.publisher | Institute of Electrical and Electronics Engineers | - |
| dc.title | A 80x60 Micro-Bolometer CMOS Thermal Imager Integrated with a Low-Noise 12-Bit DAC | - |
| dc.type | Article | - |
| dc.publisher.location | 미국 | - |
| dc.identifier.doi | 10.1109/TIE.2021.3109542 | - |
| dc.identifier.scopusid | 2-s2.0-85114744793 | - |
| dc.identifier.wosid | 000764880700104 | - |
| dc.identifier.bibliographicCitation | IEEE Transactions on Industrial Electronics, v.69, no.8, pp 8604 - 8608 | - |
| dc.citation.title | IEEE Transactions on Industrial Electronics | - |
| dc.citation.volume | 69 | - |
| dc.citation.number | 8 | - |
| dc.citation.startPage | 8604 | - |
| dc.citation.endPage | 8608 | - |
| dc.type.docType | Article | - |
| dc.description.isOpenAccess | N | - |
| dc.description.journalRegisteredClass | scie | - |
| dc.description.journalRegisteredClass | scopus | - |
| dc.relation.journalResearchArea | Automation & Control Systems | - |
| dc.relation.journalResearchArea | Engineering | - |
| dc.relation.journalResearchArea | Instruments & Instrumentation | - |
| dc.relation.journalWebOfScienceCategory | Automation & Control Systems | - |
| dc.relation.journalWebOfScienceCategory | Engineering, Electrical & Electronic | - |
| dc.relation.journalWebOfScienceCategory | Instruments & Instrumentation | - |
| dc.subject.keywordPlus | Bolometers | - |
| dc.subject.keywordPlus | Digital to analog conversion | - |
| dc.subject.keywordPlus | Infrared detectors | - |
| dc.subject.keywordPlus | Bit inversion | - |
| dc.subject.keywordPlus | Commercial products | - |
| dc.subject.keywordPlus | Current-mode dividers | - |
| dc.subject.keywordPlus | Micro-bolometers | - |
| dc.subject.keywordPlus | Noise equivalent temperature difference | - |
| dc.subject.keywordPlus | Stacking structures | - |
| dc.subject.keywordPlus | Startup time | - |
| dc.subject.keywordPlus | Thermal imagers | - |
| dc.subject.keywordPlus | CMOS integrated circuits | - |
| dc.subject.keywordAuthor | Calibration | - |
| dc.subject.keywordAuthor | CMOS thermal imager | - |
| dc.subject.keywordAuthor | Computer architecture | - |
| dc.subject.keywordAuthor | Digital-to-analog converter (DAC) | - |
| dc.subject.keywordAuthor | Integrated circuits | - |
| dc.subject.keywordAuthor | Linearity | - |
| dc.subject.keywordAuthor | Micro-bolometer | - |
| dc.subject.keywordAuthor | Microprocessors | - |
| dc.subject.keywordAuthor | NETD | - |
| dc.subject.keywordAuthor | Thermal noise | - |
| dc.subject.keywordAuthor | Voltage measurement | - |
| dc.identifier.url | https://ieeexplore.ieee.org/document/9531418 | - |
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