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Evaluation of cleaning procedure for the detection of scratches formed on oxide wafer during CMP process
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 박진구 | - |
| dc.date.accessioned | 2022-08-08T06:33:29Z | - |
| dc.date.available | 2022-08-08T06:33:29Z | - |
| dc.date.issued | 2010-03-24 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/170553 | - |
| dc.title | Evaluation of cleaning procedure for the detection of scratches formed on oxide wafer during CMP process | - |
| dc.type | Conference | - |
| dc.citation.conferenceName | SEMATECH Surface Preparation and Cleaning Conference | - |
| dc.citation.conferencePlace | Austin, Texas | - |
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Related Researcher
- Park, Jin Goo
- ERICA 공학대학 (DEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING)