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The effect of electrode heat sink in organic-electronic devices

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dc.contributor.authorChoi, Sang Hun-
dc.contributor.authorLee, Tae Il-
dc.contributor.authorBaik, Hong Koo-
dc.contributor.authorRoh, Hee Hwan-
dc.contributor.authorKwon, Ohmyoung-
dc.contributor.authorSuh, Dong hak-
dc.date.accessioned2022-10-07T09:46:24Z-
dc.date.available2022-10-07T09:46:24Z-
dc.date.issued2008-11-
dc.identifier.issn0003-6951-
dc.identifier.issn1077-3118-
dc.identifier.urihttps://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/171792-
dc.description.abstractMost of organic devices showed poor thermal stability and short lifetime due to Joule heating by current injection during operation. To increase the lifetime of the devices, thermal management must be considered. We demonstrated the polymer light-emitting diodes with thermally conductive substrate and Al/Cu double cathode to enhance the thermal stability of the device. Also, we proposed the correlation between lifetime (Delta t) and device heat sink (Delta T). The heat sink of all organic devices is required to enhance device durability.-
dc.format.extent3-
dc.language영어-
dc.language.isoENG-
dc.publisherAmerican Institute of Physics-
dc.titleThe effect of electrode heat sink in organic-electronic devices-
dc.typeArticle-
dc.publisher.location미국-
dc.identifier.doi10.1063/1.3021071-
dc.identifier.scopusid2-s2.0-55849090683-
dc.identifier.wosid000260778100078-
dc.identifier.bibliographicCitationApplied Physics Letters, v.93, no.18, pp 1 - 3-
dc.citation.titleApplied Physics Letters-
dc.citation.volume93-
dc.citation.number18-
dc.citation.startPage1-
dc.citation.endPage3-
dc.type.docTypeArticle-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaPhysics-
dc.relation.journalWebOfScienceCategoryPhysics, Applied-
dc.subject.keywordPlusLIGHT-EMITTING-DIODES-
dc.subject.keywordPlusSCANNING THERMAL MICROSCOPE-
dc.subject.keywordPlusELECTROLUMINESCENT DEVICES-
dc.subject.keywordPlusSOFTENING TEMPERATURE-
dc.subject.keywordPlusLAYERS-
dc.subject.keywordAuthoraluminium-
dc.subject.keywordAuthorcharge injection-
dc.subject.keywordAuthorcopper-
dc.subject.keywordAuthorelectrodes-
dc.subject.keywordAuthorheat sinks-
dc.subject.keywordAuthororganic light emitting diodes-
dc.subject.keywordAuthorpolymers-
dc.subject.keywordAuthorthermal stability-
dc.identifier.urlhttps://aip.scitation.org/doi/10.1063/1.3021071-
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