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Drop impact reliability of Cu-Zn/Sn-Ag-Cu/Cu-Zn solder joints
- Authors
- Kim, Young Min; Kim, Young Ho
- Issue Date
- Oct-2008
- Publisher
- IEEE
- Citation
- 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008, pp.236 - 238
- Indexed
- SCOPUS
- Journal Title
- 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008
- Start Page
- 236
- End Page
- 238
- ISSN
- 0000-0000
- Abstract
- The intermetallic growth in the Sn-Ag-Cu (SAC) solder joints fabricated on Cu or Cu-Zn solder wetting layer and it's effect on the drop impact reliability have been studied. The drop test specimens were fabricated by cormecting two printed circuit boards by reflowing SASC 405 solder balls on Cu or Cu-Zn wetting layers. And the drop test specimens were aged at 150?C up to 500 hrs. The well known bi-Iayer of CU6Sn5 and CU3Sn with mocrovoids was formed at the SAC/Cu interfaces during aging. On the other hand, orly CU6Sn5 formed at the SAC/Cu-Zn interfaces with aging. No CU3Sn and microvoids were observed and the formation of large Ag3Sn plates was suppressed remarkably. Also, the growth rate of IMCs at the SAC/Cu-Zn interface was much slower than that at the SAC/Cu interface. The number of drops to failure in the CuZn/ SAC/Cu-Zn solder joints was higher than that in the CU/SAC/Cu solder joints before and after aging. The microstructure developed in the solder interfaces greatly influenced the drop impact reliability.
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