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The fabrication and characterization of organic light-emitting diodes using transparent single-crystal Si membranes

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dc.contributor.authorLee, Su-Hwan-
dc.contributor.authorKim, Dal-Ho-
dc.contributor.authorKim, Ji-Heon-
dc.contributor.authorTakeo, Katoh-
dc.contributor.authorLee, Gon-Sub-
dc.contributor.authorPark, Jea-Gun-
dc.date.accessioned2022-12-20T20:21:23Z-
dc.date.available2022-12-20T20:21:23Z-
dc.date.issued2009-11-
dc.identifier.issn0957-4484-
dc.identifier.issn1361-6528-
dc.identifier.urihttps://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/175967-
dc.description.abstractFor applications such as solar cells and displays, transparent single-crystal Si membranes were fabricated on a silicon-on-insulator (SOI) wafer. The SOI wafer included a buried layer of SiO2 and Si3N4 as an etch-stop layer. The etch-stop layer enabled fabrication of transparent single-crystal Si membranes with various thicknesses, and the thinning technology is described. For membranes with thicknesses of 18, 72 and 5000 nm, the respective optical transparent were 96.9%, 93.7% and 9% for R (red, lambda = 660 nm), 96.9%, 91.4% and 1% for G (green, lambda = 525 nm), and 97.0%, 93.2% and 0% for B (blue, lambda = 470 nm). Organic light-emitting diodes (OLEDs) were then fabricated on transparent single-crystal Si membranes with various top Si thicknesses. OLEDs fabricated on 18, 72 and 5000 nm thick membranes and operated at 6 V demonstrated a luminance of 1350, 443 and 27 cd m(-2) at the current densities of 148, 131 and 1.5 mA cm(-2), respectively.-
dc.format.extent8-
dc.language영어-
dc.language.isoENG-
dc.publisherInstitute of Physics Publishing-
dc.titleThe fabrication and characterization of organic light-emitting diodes using transparent single-crystal Si membranes-
dc.typeArticle-
dc.publisher.location영국-
dc.identifier.doi10.1088/0957-4484/20/45/455202-
dc.identifier.scopusid2-s2.0-70350645169-
dc.identifier.wosid000270904600008-
dc.identifier.bibliographicCitationNanotechnology, v.20, no.45, pp 1 - 8-
dc.citation.titleNanotechnology-
dc.citation.volume20-
dc.citation.number45-
dc.citation.startPage1-
dc.citation.endPage8-
dc.type.docTypeArticle-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaScience & Technology - Other Topics-
dc.relation.journalResearchAreaMaterials Science-
dc.relation.journalResearchAreaPhysics-
dc.relation.journalWebOfScienceCategoryNanoscience & Nanotechnology-
dc.relation.journalWebOfScienceCategoryMaterials Science, Multidisciplinary-
dc.relation.journalWebOfScienceCategoryPhysics, Applied-
dc.subject.keywordPlusSILICON-
dc.subject.keywordPlusIMPLANTATION-
dc.subject.keywordPlusNITRIDE-
dc.subject.keywordPlusSTRESS-
dc.identifier.urlhttps://iopscience.iop.org/article/10.1088/0957-4484/20/45/455202-
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