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A new solder wetting layer for Pb-free solders
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Oh, Chang Yul | - |
| dc.contributor.author | Roh, Hee-Ra | - |
| dc.contributor.author | Kim, Young Min | - |
| dc.contributor.author | Lee, Jin Soo | - |
| dc.contributor.author | Cho, Hae Young | - |
| dc.contributor.author | Kim, Young-Ho | - |
| dc.date.accessioned | 2022-12-20T23:34:17Z | - |
| dc.date.available | 2022-12-20T23:34:17Z | - |
| dc.date.created | 2022-08-26 | - |
| dc.date.issued | 2009-02 | - |
| dc.identifier.issn | 0884-2914 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/177296 | - |
| dc.description.abstract | We developed a new Cu-Zn wetting layer for Pb-free solders. By adding Zn to the Cu wetting layer, intermetallic growth in the Sn-Ag-Cu (SAC) solder interfaces was delayed. Cu3Sn intermetallic compounds and microvoids were not observed ill the SAC/Cu-Zn interfaces after aging. The drop reliability of the SAC solder/Cu-Zn joints was excellent. | - |
| dc.language | 영어 | - |
| dc.language.iso | en | - |
| dc.publisher | SPRINGER HEIDELBERG | - |
| dc.title | A new solder wetting layer for Pb-free solders | - |
| dc.type | Article | - |
| dc.contributor.affiliatedAuthor | Kim, Young-Ho | - |
| dc.identifier.doi | 10.1557/JMR.2009.0047 | - |
| dc.identifier.scopusid | 2-s2.0-61749087132 | - |
| dc.identifier.wosid | 000267207600001 | - |
| dc.identifier.bibliographicCitation | JOURNAL OF MATERIALS RESEARCH, v.24, no.2, pp.297 - 300 | - |
| dc.relation.isPartOf | JOURNAL OF MATERIALS RESEARCH | - |
| dc.citation.title | JOURNAL OF MATERIALS RESEARCH | - |
| dc.citation.volume | 24 | - |
| dc.citation.number | 2 | - |
| dc.citation.startPage | 297 | - |
| dc.citation.endPage | 300 | - |
| dc.type.rims | ART | - |
| dc.type.docType | Article | - |
| dc.description.journalClass | 1 | - |
| dc.description.isOpenAccess | N | - |
| dc.description.journalRegisteredClass | scie | - |
| dc.description.journalRegisteredClass | scopus | - |
| dc.relation.journalResearchArea | Materials Science | - |
| dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
| dc.subject.keywordPlus | SN-AG-CU | - |
| dc.subject.keywordPlus | INTERFACIAL REACTIONS | - |
| dc.subject.keywordPlus | SN-3.5AG SOLDER | - |
| dc.subject.keywordPlus | ZN | - |
| dc.subject.keywordPlus | MICROSTRUCTURE | - |
| dc.subject.keywordPlus | RELIABILITY | - |
| dc.subject.keywordPlus | ALLOYS | - |
| dc.subject.keywordPlus | GROWTH | - |
| dc.identifier.url | https://link.springer.com/article/10.1557/JMR.2009.0047 | - |
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