Crack suppression and residual stress in BaTiO3 based Ni-MLCCs of Y5V specification through post-process
DC Field | Value | Language |
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dc.contributor.author | Kang, Ji-Hun | - |
dc.contributor.author | Cha, Hyun-Min | - |
dc.contributor.author | Jung, Yeon-Gil | - |
dc.contributor.author | Paik, Ungyu | - |
dc.date.accessioned | 2022-12-21T01:49:42Z | - |
dc.date.available | 2022-12-21T01:49:42Z | - |
dc.date.created | 2022-08-26 | - |
dc.date.issued | 2008-08 | - |
dc.identifier.issn | 0924-0136 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/178113 | - |
dc.description.abstract | The effects of an additional processing using pressure and heat treatment, that is, a "post -process", on crack suppression and residual stress are investigated in BaTiO3-based multilayer ceramic capacitors (MLCCs) with Y5V characteristics. At the planes (margins) parallel to the electrode, the crack length is dramatically reduced after the post-process in the direction parallel to the electrode, without a change in the direction perpendicular to the electrode. At the plane perpendicular to the electrode, the crack length is modestly reduced in both parallel and perpendicular directions. The post-process is effective in reducing the difference in crack length between directions at each plane. The residual tensile stresses induced at the planes of the MLCCs before the post-process are converted to the compressive stresses and the residual compressive stresses are enhanced through the post-process. The MLCCs after the post-process show the residual compressive stress of approximately 300 MPa throughout entire planes. (c) 2007 Elsevier B.V. All rights reserved. | - |
dc.language | 영어 | - |
dc.language.iso | en | - |
dc.publisher | ELSEVIER SCIENCE SA | - |
dc.title | Crack suppression and residual stress in BaTiO3 based Ni-MLCCs of Y5V specification through post-process | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Paik, Ungyu | - |
dc.identifier.doi | 10.1016/j.jmatprotec.2007.11.093 | - |
dc.identifier.scopusid | 2-s2.0-44749089832 | - |
dc.identifier.wosid | 000257640500019 | - |
dc.identifier.bibliographicCitation | JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, v.205, no.1-3, pp.160 - 167 | - |
dc.relation.isPartOf | JOURNAL OF MATERIALS PROCESSING TECHNOLOGY | - |
dc.citation.title | JOURNAL OF MATERIALS PROCESSING TECHNOLOGY | - |
dc.citation.volume | 205 | - |
dc.citation.number | 1-3 | - |
dc.citation.startPage | 160 | - |
dc.citation.endPage | 167 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.description.journalClass | 1 | - |
dc.description.isOpenAccess | N | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Engineering | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalWebOfScienceCategory | Engineering, Industrial | - |
dc.relation.journalWebOfScienceCategory | Engineering, Manufacturing | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.subject.keywordPlus | CERAMIC MULTILAYER CAPACITORS | - |
dc.subject.keywordPlus | MECHANICAL-PROPERTIES | - |
dc.subject.keywordPlus | ELECTRICAL-PROPERTIES | - |
dc.subject.keywordPlus | MICROSTRUCTURE | - |
dc.subject.keywordPlus | BEHAVIOR | - |
dc.subject.keywordAuthor | BaTiO3 | - |
dc.subject.keywordAuthor | multilayer ceramic capacitors | - |
dc.subject.keywordAuthor | (MLCCs) | - |
dc.subject.keywordAuthor | post-process | - |
dc.subject.keywordAuthor | crack suppression | - |
dc.subject.keywordAuthor | residual stress | - |
dc.identifier.url | https://www.sciencedirect.com/science/article/pii/S0924013607011193?via%3Dihub | - |
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